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Evaluation of the Nanofabrication and Corrosion on Copper by In-situ ECAFM

以電化學原子力顯微鏡進行純銅之奈米加工與腐蝕現象之即時觀察研究

摘要


本文以電化學原子力顯微鏡(ECAFM)在Contact Mode模式下探討純銅在去離子水與外加電壓的環境下的奈米加工與腐蝕現象,並即時觀察純銅之奈米級表面形貌的變化行為。研究後發現純銅在去離子水與外加電壓的環境下,初期ECAFM的矽探針對純銅表面會產生奈米等級的切削作用,而加工出一清晰可見的凹洞,但此切削作用會因電化學作用時間增加而降低,其原因乃是氧化行為所造成。在EC-AFM探針未持續掃描的純銅表面區域,其表面突起部分會因氧化而變大。

關鍵字

無資料

並列摘要


This study used the Electrochemical Atomic Force Microscopy (ECAFM) in Contact Mode to discuss the nanofabrication and corrosion of pure Cu in an environment with DI water and applied voltage. It also observed the morphological changes of nanometric surfaces of pure Cu. The results showed that in the environment of DI water and applied voltage, the silicon probe of ECAFM would have a nanometric cutting effect at an early stage on a pure Cu surface, thus producing a visible hole. However, such cutting effects would be diminished with time when electrochemical machining is prolonged, due to oxidation effects. If the EC-AFM probe does not continuously scan the pure Cu surface areas, the protrusions on the surface would extend due to oxidation.

並列關鍵字

ECAFM Pure Cu Oxidation Nanoscale Cutting

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