KINETIC EXAMINATION OF COPPER ADSORPTION ON CHELATING RESIN

螯形官能基樹脂對銅之吸附動力學研究

馮文龍(Wen-Lung Feng) ； 何英礎(Ying-Chu Hoh)

《鑛冶：中國鑛冶工程學會會刊》 30卷2期 (1986/06) Pp. 104-112

https://doi.org/10.30069/MM.198606_30(2).0010

摘要

Kinetic phenomena of copper adsorption on iminodiacetic acid containing TP-207 chelating type resin has been studied. The results indicate that the controlling mechanism for copper adsorption is intraparticle diffusion. Vermeulen's simplified model, based on Fick's law, was used to fit the experimental data and showed good confirmation. Intraparticle diffusion coefficients were also determined from the graphical representation of the proposed model. Arrhenius equation was used to examine the temperature sensitivity on copper adsorption rate and activation energy was also evaluated for this particular system.

並列摘要

本篇研究報告係針導銅在螫形官能基樹脂上之離子交換測象，作吸附動力學之探討，實驗結果顯示粒子内擴散為整個吸附過程之控制步驟，而所有不同之操作條件均可適用於粒子內擴散模式，並可利用此一模式，對各種不同直徑之樹脂顆粒，分別求得粒子內之擴散係數。實驗結果亦證明擴散速率對溫度之變化具有高度敏感性，利用各種不同溫度下所測得之擴散速率，可求得銅吸附過程之活化能。