大理石材之化學機械研磨（CMP）性質研究

化學機械研磨（Chemomechanical polishing，簡稱CMP）技術已廣泛應用在工業礦物與材料製造過程中。大理石材表面對酸的反應快速，大理石材表面的懸空鍵產生的非定義域作用、酸蝕後的鍵結及研磨過程變化，均可在紅外光頻譜中得到，由此觀察大理石材表面現象。以酸性環境化學機械研磨，大理石材表面不斷與草酸溶液作用生成碳酸鈣顆粒附著表面，且長時間研磨下，造成侵蝕孔洞。以鹼性環境之化學機械研磨，矽酸鈉溶液不改變大理石材表面平坦程度，而矽酸鈉具有充填膠結作用，會在大理石材表面生成一層薄膜，充填原先存在於表面的孔洞或裂縫。α膠液是草酸與矽酸鈉滴定共沈的白色粒狀物質，存在於pH = 1.43〜3.50問，粒徑分佈在5μm〜100μm內，會溶於水中，但不溶於酒精，屬於一種鈉矽有機物質。α膠液屬於酸性環境化學機械研磨，與大理石材表面產生化學反應，在大理石材表面形成特定深度之保護膜。

關鍵字

化學機械研磨；大理石；紅外光譜；矽酸鈉；草酸

並列摘要

Chemomechanical polishing (CMP) for planarization has become one of the most rapidly growing segments in the semiconductor manufacturing market. The speed of the marble surface reaction to acid is very fast. We can observe the marble surface before and after acid etching and polishing process by means of infrared spectroscope. Under the acid circumstance, the oxalic acid will react with the marble surface and produces fine calcite particles attached on the surface. After a long time of polishing, this reaction will cause etching pores. CMP under alkaline condition, sodium silicate solution has the function of gelation, and forms a film on the marble surface which filling the pores and cracks on the marble surface, instead of planarization. α-serum is a kind of Na-Si organic substance co-precipitated from oxalic acid and sodium silicate. This serum is formed in the range of pH from 1.43 to 3.50 and the particle's size is distributed between 5μm~100μm.. It can dissolve in water, but can't dissolve in alcohol. α-serum will offer a chemical reaction in the polishing of marble under acid condition. By means of mechanical polishing, it can promote the function of planarization, in the mean time, the chemical reaction ca n also remove the scraps caused by mechanical polishing.

並列關鍵字

Chemomechanical polishing (CMP) ； marble ； planarization ； infrared spectroscope ； oxalic acid ； sodium silicate

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大理石材之化學機械研磨（CMP）性質研究

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