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紅外線熱像儀應用於合板欠膠之檢測

Application of infrared Thermography on Detection of Starved Joint of Plywood

摘要


本研究計畫之目的係探討紅外線熱像儀應用於合板膠合不良之檢測之可行性,即在試驗中以欠膠方式造成膠合不良之合板為材料,在燈泡照射加熱之過程中,利用紅外線熱像儀監測其表面溫度之變化,檢討欠膠部位與非欠膠部位間溫度變化之差異,確定膠合不良之位置。   由試驗結果得知合板表面經燈泡照射加熱過程中,欠膠部位之溫度升高較其周邊非欠膠部位者明顯,且兩者間之差異隨加熱時間之增長而增大,由於合板表面溫度明顯上升之處與欠膠部位一致,顯示可利用紅外線熱像儀進行非破壞試驗,檢測出合板膠合不良之位置。

並列摘要


The objective of this project was to investigate the feasibility of using infrared thermography in detection of starved joint of plywood. In this test, plywood including starved joint was made by urea resin. The surface temperature of plywood specimens heated by lamp was measured with a thermographic device. The differences of temperature changes between starved joint and non-starved joint were discussed for identifying the location of gluing defects.   The temperature rise on the plywood surface of the starved joint was more obvious than that of sound joint, and the differences between the two increased with increasing heating time. Because the place on the plywood surface showed evident temperature rise with the location of starved joint, the thermographic technique should be applicable to non-destructive test for examining starved joint of plywood.

被引用紀錄


陳人仕(2011)。熱影像應用於剛性鋪面版底孔洞檢測技術之研究〔碩士論文,國立臺北科技大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0006-1908201116432500

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