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Rapid Prototyping of Hardware/Software Codesign for Embedded Signal Processing

並列摘要


In this paper, we propose a target board architecture suitable for embedded signal processing applications based on hardware software codesign. The target board, which serves as a system attached to a host PC via a PCI bus interface, contains a TMS320C30 DSP processor and up to four Xilinx XC5204 FPGAs. The software and hardware sections of the codesign can be easily implemented using C and VHDL programming in the C30 processor and FPGAs, respectively. Based on the proposed target board architecture, the interface circuitry and the communication protocols between the hardware (FPGAs) and software (C30) sections are first derived. The interface circuitry is described in VHDL code and will be added to the FPGA design for high level synthesis. Five types of HW/SW communications are supported. A HW/SW codesign flow is also exploited, and a partitioning verification procedure is developed. To illustrate the merits of the proposed system, a HW/SW codesign implementation example based on the G.728 LD-CELP decoder for speech compression is described.

被引用紀錄


王齡瑤(2011)。利用電沉積法製備二硒化銅銦薄膜應用於太陽能電池之研究〔碩士論文,國立虎尾科技大學〕。華藝線上圖書館。https://doi.org/10.6827/NFU.2011.00095
You, Y. P. (2007). 低功率嵌入式處理器之編譯器最佳化研究 [doctoral dissertation, National Tsing Hua University]. Airiti Library. https://www.airitilibrary.com/Article/Detail?DocID=U0016-1206200714114946

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