自組裝單層技術在先進銅金屬化製程的應用發展

Application and Development of Self-Assembled Monolayer Technology for Advanced Copper Metallization

陳松德(Sung-Te Chen) ； 陳錦山(Giin-Shan Chen)

《真空科技》 33卷1期 (2020/03) Pp. 40-55

摘要

自組裝單層技術具有製程簡單、選擇多樣性、分子級厚度與極佳的披覆性。此外，運用不同的自組裝單層終端官能基，即可輕易改變基材表面的物理或化學性質，而提高其性能與應用性。近年來，自組裝單層技術相當受到半導體產業的重視，在國際裝置與系統發展路線藍圖（International Roadmap for Devices and Systems, IRDS）報告更指出其為先進銅導線製程新興分子級技術解決方案之一。因此，本文特別針對常見的有機矽烷基與醇硫基自組裝分子種類進行介紹，以及自組裝單層的生長機制與製程技術，並介紹其應用在先進銅金屬化製程的孔隙密封、附著性、阻障層和晶種的性能表現與未來發展性。

關鍵字

自組裝單層 ； 矽烷基 ； 醇硫基 ； 銅金屬化製程 ； 孔隙密封 ； 附著性 ； 阻障層 ； 晶種

並列摘要

Self-assembled monolayer (SAM) technology has the advantages of simple process, diversity of alternatives, and high-quality coating for the molecular scale, and excellent cover-ability. In addition, physical or chemical properties of the substrate surface has easily modified by the terminal functional groups of self-assembled molecules, thereby improving its performance and applicability. Due to SAMS of unique functional properties and potential applications have considered for the semiconductor industry in recent year. In the International Roadmap for Devices and Systems (IRDS) report, the SAM technology also has become one of the emerging molecular level technology for advanced copper metallization. Therefore, this article specifically introduces two types of organosilanes and thiols based self-assembled molecules, as well as the growth mechanism and process. Meanwhile, the article also introduces the self-assembled monolayers performance for pore-sealed, adhesion, barrier and seeds of advanced copper metallization processes in the future development.

並列關鍵字

self-assembled monolayer ； organosilanes ； thiols ； copper metallization ； pore-sealed ； adhesion ； barrier ； seeds