高熱傳導性聚醯亞胺複合材料之研究

本研究是藉由三種單體4,4’－Oxydianiline（ODA）、3,3’－Dihydroxybenzidine（HAB）及Pyromellitic dianhydride（PMDA）製備成聚醯亞胺酸（Polyamic-acid，PAA）預聚物，其中HAB具有-OH官能基，再進一步加入偶合劑3-isocyanatopropyl triethoxysilane（IPS）時，會與IPS先進行鍵結，之後再添加具有高熱傳導性的無機物氮化鋁與氮化硼，並於加熱脫水之熱醯亞胺環化反應後，製備成聚醯亞胺／無機複合材料，並研究分析此複合材料的型態學、機械性質和熱傳導性質。從研究結果發現，經此合成方法製得的聚醯亞胺／氮化鋁與氮化硼複合材料，比用一般傳統合成方法製備之複合材料，具有更好的相容性。而且當加入氮化鋁與氮化硼後，高分子材料的熱性質也穩定提升。在熱傳導性試驗中，只添加了氮化硼10 phr時，熱傳導率就比純的的聚醯亞胺提高了3倍，顯示傳導的路徑及網絡形成，有助於複合材料的散熱行為。

關鍵字

氮化硼；聚醯亞胺；醯亞胺化

並列摘要

In this study, polyamic acid prepolymer is prepared through three monomers: 4,4' Oxydianiline (ODA), 3,3'-Dihydroxybenzidine (HAB) and Pyromellitic dianhydride (PMDA). Then the coupling agent (3-isocyanatopropyl triethoxysilane, IPS) was added and the hydroxy group on the HAB will further react with the IPS. Subsequently, the high thermal conductive inorganic matters (aluminum nitride and boron) were added into the polymer matrix, and the thermal imidization was then proceed by dehydration via heating process. Through these procedures, the polyimide/inorganic compound composite was obtained. The morphology, mechanical properties and thermal conductive properties were investigated. It is found that the composites prepared by this procedure have better compatibility with the inorganic compounds than that of the composites prepared by traditional method. And after adding the aluminum nitride and boron nitride, thermal properties of polymer materials were enhanced. The thermal conductivity of the composite containing 10 phr of boron nitride was about three times of the pristine polyimide. This indicates that the conductive paths and networks were formed, and can help the heat dissipation of composite materials.

並列關鍵字

boron nitride (BN) ； polyimide ； imidization

國際替代計量

高熱傳導性聚醯亞胺複合材料之研究

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