新穎聚亞醯胺高分子與低介電材料合成及其性質研究

Preparation, characterization, and properties of novel polyimides and low–k materials

陳詩沂(Shi-Yi Chen)

指導教授 ： 劉英麟

中原大學/工學院/化學工程研究所/碩士(2007年)

https://doi.org/10.6840/cycu200700395

摘要

本實驗進行一系列以聚亞醯胺為主體的新材料合成，主要包括兩大方法，一個是以Diels-Alder反應方法形成含氟聚亞醯胺團聯高分子(block polymer)，目前文獻上尚未有學者利用Diels-Alder方法來將兩種聚亞醯胺結合，本研究成功的將具雙邊馬來醯胺基(dienophile)及雙邊呋喃基(diene)的含氟聚亞醯胺，具有熱可逆的特性使其具有加熱易移除的優點，並探討其逆反應之反應動力學。另一個是以Michael加成方法，在含氟聚亞醯胺中導入POSS，達到降低介電常數的目的，配合THF塗佈法可將介電常數由純含氟聚亞醯胺的3.00降至1.49。另外，本研究發現不同旋轉塗佈溶劑會影響膜的型態結構，其中以THF為旋轉塗佈溶劑會得到孔洞結構，利用此法可有效降低材料介電常數值。

關鍵字

多面體聚矽氧烷 ； 介電常數 ； 奈米複合材料 ； 聚亞醯胺 ； 低介電材料

並列摘要

In this study, two series of novel polyimides (PI) were synthesized via Diels-Alder reaction and Michael addition. Initiation of using Diels-Alder strategy between maleimide (dienophile) and furan (diene) functional groups of polyimides, polyimide block copolymer (PIDA) was successfully prepared. It went back to more removable reactants by heating, and the reaction dynamics was also discussed. Introducing polyhedral oligomeric silsesquioxane (POSS) into fluoro-polyimide and then spin-coat with THF reduced dielectric constant from 3.00 (pure PI) to 1.49. Different solvents of spin-coating cause various structures, and porous structure relating to lowering dielectric constant could be achieved easily by spin-coating the polymers with THF.

並列關鍵字

dielectric constant ； nanocomposite ； POSS ； polyimide

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