Since 1990's, ball grid array (BGA) assembly technology was developed by Motorola and Citezen to support high I/O count design requirement. IC substrate is a primary carrier and widely used by the BGA assembly technology. Bond Finger (BF) nodule defect contributes as top 1 defect of overall defects and caused customer high LRR (Lot Reject Rate) on wire bonding substrate. Hence, it is important to identify the root causes to reduce this failure. To improve this problem, Six Sigma Methodology is deployed on this project (Pande et al., 2002). Initial investigation indicates several factors in Ni plating process. By Cause & Effect Matrix and Pareto analysis, four factors are clarified as most possible root causes. To tackle this problem, DOE was conducted to find the optimized process control conditions. After improvement, the customer LRR reduce from 0.27% to 0.04% and 70.8% cost saving. It is encouraging to deploy the quality improvement with Six Sigma Methodology.