Electroless plating is deposition of metals/alloys on the surface of materials which are not electric conductors such as plastics, ceramics, and glass. Electroless plating makes attractive appearance and prevent corrosion of materials. Sputtering of titanium or electrleoss plating of nickel before electroplating of gold or copper is commonly found on the processes of silicon wafer manufactures. These films can inhibit silicon atoms to diffuse into gold or copper atoms for the formation of silicon alloys. This study conducts a research aiming at the effects of types of reductants, concentration of reductants, pH value on the samples pretreated with roughening, sensitizing, activating. From the results in this study, the solutions with low and high pH values are preferred for the electroless deposition of copper using sodium hypophosphite and formaldehyde, respectively.