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應用機台加工效率指標提升機台之生產速度:以台灣某十二吋晶圓代工廠為例

Applying Running Efficiency to Improve the Production Speeds of Processing Tools: Case Study of a 300mm IC Foundry in Taiwan

摘要


機台綜合效率(overall equipment efficiency, OEE)結合了機台生產良率(quality efficiency, QE)、可生產率(available efficiency, AE)、操作效率(operational efficiency, OE)與速度效率(rate efficiency, RE)等四項指標,是廣為半導體業界用來評量機台生產力(productivity)的一個綜合指標,其中RE指標更是晶圓廠生產線的管理者用來評量及監控機台是否維持在最大生產速度狀況的一個常用指標。然而RE指標容易受到外在生產環境的干擾,常無法準確評量出機台實際之速度效率,因此很容易喪失改善的機會,而導致機台與晶圓廠產能降低及晶片生產週期延長。針對此問題,本研究之主要目的是針對RE指標之缺失另提出一個適用於晶圓廠的加工效率(running efficiency, RUNE)指標來取代RE指標,以協助晶圓廠管理者隨時將機台維持在最大生產速度的理想狀況。本研究以台灣某十二吋晶圓代工廠為例,比較以RE指標與RUNE指標評量晶圓廠內機台速度效率的差異,並利用問卷調查的方式來探討晶圓廠管理者在應用RE指標時因評估機台速度效率的偏差所可能導致的機台產能損失,以証明本研究所提之RUNE指標確實較RE指標穩健(robust)且可精確地衡量出機台之真實速度效率。

並列摘要


Overall equipment efficiency (OEE) is a composite metric, which includes quality efficiency (QE), available efficiency (AE), operational efficiency (OE) and rate efficiency (RE). OEE is widely adopted in semiconductor manufacturing to assess and enhance the productivities of processing tools. The RE is a very popular index for the fab managers to evaluate or monitor whether the processing tools keep their maximum production speeds. However, the RE is easily influenced by the production environment, and thus it can not be utilized to evaluate the actual production speeds of the processing tools. Consequently, the improvement opportunity and fab capacity are missed due to the biased measurement of RE. Therefore, this study develops a running efficiency (RUNE) to replace of RE for helping the fab managers to keep the processing tools in their maximum production speeds. A case study of a 300m IC foundry in Taiwan is utilized to demonstrated the evaluation results of the production speeds of the processing tools based on RE and RUNE, respectively. Finally, a survey is conducted to quantify the potential capacity losses of tools due to the decline of production speeds caused by the biased RE measurement. The RUNE is proved to be more robust than RE, and thus can evaluate the true production speeds of the processing tools more accurately.

參考文獻


Freck, R. W.(2000).Using overall equipment effectiveness (OEE) and the equipment improvement process (EI) to improve Fab throughput.Proc. of 2000 IEEE/SEMI Advanced Semiconductor Manufacturing Conf. (ASMC).(Proc. of 2000 IEEE/SEMI Advanced Semiconductor Manufacturing Conf. (ASMC)).
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