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多晶矽無接面電晶體技術

Poly-Si Junctionless Device Technology

摘要


藉由沉積具有高摻雜濃度磷原子的多晶矽層,我們利用其來當作奈米線以及平面式無接面電晶體的通道層。多晶矽無接面電晶體係具有從源極經由通道到達汲極皆擁有一樣的原子摻雜種類與濃度。由於在薄膜沉積過程中有順勢摻雜,因此讓元件可以擁有均勻且高濃度的摻雜形貌,使得製程能夠簡單化。另外,所製備的無接面電晶體擁有高濃度的傳輸載子,因此大幅提升了輸出電流,使得元件擁有表現良好的高開關電流比。無接面電晶體的高摻雜形式也大幅的降低了源極汲極外部阻抗所帶來的影響。如此的無接面電晶體結構,將更適用於未來3D積體電路與面板產品的製作。

並列摘要


An in situ doped silicon layer was deposited to serve as the channel of nanowire and planar junctionless transistor. The concentration and doping type of channel is identical to that of source and drain for junctionless transistors. In situ doped poly-Si material features high and uniform-doping concentration, facilitating the fabrication process. Due to high concentration, the junctionless transistors exhibit superior electrical characteristics in terms of higher on/off current ratio and lower source/drain resistance. Such a scheme shows a promising alternative for the future application of 3D-ICs and flat panel products.

被引用紀錄


蔡佩勳(2015)。不同閘極結構之無接面複晶矽奈米線薄膜電晶體的特性研究〔碩士論文,逢甲大學〕。華藝線上圖書館。https://doi.org/10.6341/fcu.M0212551

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