Due to the increasing demands of various products and compact components, the needs to develop metallization technology in devices of microwave dielectric ceramics become imperative and important. The microwave dielectric ceramic is very effective for manufacturing smaller devices and improving the package density of integrated circuits. The purpose of this paper is to develop ceramic laser metallization technology to fabricate devices of microwave dielectric ceramics for the applications in high-frequency 38 GHz antenna and GPS antenna. In comparison to the conventional technology of screen printing of silver pastes sintered under high temperature, the laser metallization is a low-temperature process with rapid speed. Moreover, the position and line-width of metal lines could be precisely controlled by laser irradiation and stages. Therefore, the smallest line-width could be lower than 30 μm and the precision of line position could be within the range of ±50 μm. The achievement of smallest line-width and precision of line position fulfills the requirements of B4G and 5G high-frequency antenna. This technology could also effectively save energy because of its low-temperature process.