電漿蝕刻技術於晶圓切割產業之應用

Application of Plasma Etching Technology in Wafer Dicing

沈家志 ； 林冠宇 ； 張家豪 ； 劉志宏

《機械工業雜誌》 438期 (2019/09) Pp. 43-51

摘要

電漿蝕刻製程在半導體晶片製造中為相當成熟的前段製程技術，已廣泛被應用於微機電（MEMS）微加工與立體（3D）封裝中的穿孔蝕刻等流程，而近年來因應後段半導體製程之晶圓切割技術需求提升，電漿蝕刻技術於晶圓切割產業之應用開始被關注並投入大量的開發資源。本文將會討論電漿切割於晶圓切割產業的關鍵議題與挑戰，並介紹目前電漿蝕刻設備相關進展與驗證結果。

關鍵字

電漿蝕刻 ； 電漿切割 ； 晶圓切割

並列摘要

Plasma etching process is a well-established front-end process in fabrication of semiconductor chips. This process has been widely used in micromachining of Microelectronic Mechanical Systems (MEMS) and etching via holes in three dimensional (3D) packaging process. However, the demand for wafer dicing technology in the back-end of semiconductor processing has increased. As such, the application of plasma etching technology in wafer dicing industry has been emphasized, and a lot of development resources were invested. In this paper, the key issue and challenge of plasma dicing in wafer cutting industry will be discussed, and the current status of plasma etching equipment and verification of preliminary process results will be presented.

並列關鍵字

Plasma etching ； Plasma dicing ； Wafer dicing