高硬度模組化懸臂式微機電探針製造技術

本文針對高階CIS檢測提出模組化微機電懸臂式探針製造技術。此製造技術中需整合3D陶瓷電路板、陣列式高硬度合金探針製造及雙面對準接合等多項半導體精密製造技術。利用ANSYS模擬分析預先設計出可耐高溫150℃之材料與模組結構，以確保在冷熱衝擊下的環境，探針模組不會有材料崩裂等現象。3D電路採用低熱膨脹係數氧化鋯特殊陶瓷基板，並以雷射觸發金屬化技術進行3D電路製作。此外，由於模組化微機電探針需考量探針材料的性質如高硬度與耐磨耗性之需求。所以我們整合開發出鎳鈷磷（Ni-Co-P）三元合金金屬化技術與高深寬比鎳鈷填孔電鍍技術，開發出高硬度合金探針，其硬度高達800HV。最終，透過以雙面對準接合技術，將3D電路板與模組化陣列式懸臂合金探針完成模組化接合，無須人工逐一裝針。

關鍵字

3D陶瓷電路板；微機電探針；三元合金

並列摘要

This article proposes a modular micro-electromechanical system (MEMS) cantilever probe manufacturing technology for high-level copper indium gallium selenide (CIS) testing. This manufacturing technology integrates multiple semiconductor precision manufacturing technologies, including 3D ceramic circuit boards, arrayed high-hardness alloy probe manufacturing, and double-sided alignment bonding. ANSYS simulation analysis is used to design materials and module structures that can withstand temperatures up to 150℃, ensuring that the probe module will not experience material cracking or other issues during cold and hot shocks. The 3D circuit adopts a special zirconia ceramic substrate with low thermal expansion coefficient, and laser-triggered metallization technology is used for 3D circuit fabrication. In addition, the properties of the probe material, such as high hardness and wear resistance, must be considered for the modular MEMS probe. Therefore, we integrate and develop nickel-cobalt-phosphorus (Ni-Co-P) ternary alloy metallization technology and high-aspect-ratio nickel-cobalt filling electroplating technology to develop high-hardness alloy probes with a hardness of up to 800 HV. Finally, double-sided alignment bonding technology is used to complete the modular assembly of the 3D circuit board and the modular arrayed cantilever alloy probes, without the need for manual needle installation.

並列關鍵字

3D ceramic circuit board ； MEMS Probe ； Ternary Alloys

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