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  • 學位論文

電子束微影基於微機電技術之電子透鏡製作與可製造性分析

FABRICATION AND MANUFACTURABILITY ANALYSIS OF MEMS-BASED ELECTRON LENS FOR ELECTRON BEAM DIRECT-WRITE LITHOGRAPHY

指導教授 : 蔡坤諭

摘要


電子束微影術為一種極具潛力的次世代微影技術,在於具有高的解析度以及不需要光罩的製作,但是缺點為較低的產能。為了改善低產能的問題,微小化靜電元件可應用於多電子束微影系統中。 然而,電子透鏡的對準為影響其聚焦特性的一大問題。因此使用先陽極接合再鑽孔的微機電技術方法來製作電子透靜可避免對準精度的問題。 在本論文中,提出多電子束微影技術系統內的電子透鏡結構。電子透鏡可以聚焦電子束於矽晶圓上,然而,加工精確性會影響電子透鏡的製作,因此提出影像處理方法及疊對的方法來改善加工的精確性。此外,利用IES LORENTZ 套裝軟體及MATLAB 針對先陽極接合再鑽孔的微機電技術所製作的電子透靜的可製造性分析包括錐形結構及電子透鏡基板不平坦度影響。由可製造性的分析可知使用先陽極接合再鑽孔的方法所製作的電子透鏡可用於電子直寫式微影。

並列摘要


Electron beam lithography is one of the promising candidates for next generation lithography because of the ultra-high resolution and the property of no mask need, but low throughout is the significant drawback. In order to improve the problem of slow throughput, miniature electrostatic elements can be widely applied to multiple electron-beam lithography system. However, the misalignment problem of electron lens is the significant effect to focusing property of electron lens, thus bond-then-drill method based on MEMS technology for fabricating electron lens can prevent misalignment problem. In this thesis, architecture of electron lens for multiple electron beam lithography system is proposed. It can focus the electrons on the wafer. However, electron lens fabrication has the effect of fabrication accuracy, thus image process and overlay methods are proposed via MATLAB programming to improve fabrication accuracy. Besides, manufacturability analysis of MEMS-based electron lens with bond-then-drill method includes the effects of taper shapes structure and flatness variation is proposed by using Lorentz and MATLAB. It is believed that electron lens fabrication with bond-then-drill method can be useful for electron beam direct-write lithography.

參考文獻


[1] E. Kratschmer, et al., “Experimental evaluation of a 20x20 mm footprint microcoumn,”
J. Vac. Sci. Technol. B, vol. 14, No.6, 1996
[2] E. Kratschmer, et al., “Sub-40 nm Resolution 1 keV Scanning Tunneling Microscope
[3] T. H. P. Chang, et al., “Multiple Electron-beam Lithography,” Microelectronic
[4] H. Kim, et al., "The Novel Deflection for Multi Arrayed Microcolumn Using

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