半導體設備產業廠商經營策略分析--以漢微科公司為例

台灣在這三十多年來努力於半導體事業，對台灣的經濟供獻卓著，其產值排名是世界第二，但是台灣絕大多數的半導體設備都仰賴國外進口，半導體設備影響半導體積體電路的良率與可靠度至巨，如果台灣本土設備能加入，而形成完整產業鏈，對台灣半導體業乃至整體電子業都是很大助益。漢民微測科技(簡稱漢微科)是小規模公司但卻能創造了上千億台幣的價值，以上激起本人對此研究的興趣。在此研究中，先分析半導體積體電路產業結構與發展趨勢，瞭解「摩爾定律」與「超越摩爾定律」的意涵；運用策略群組的觀念，做半導體設備市場的區隔；用波特國家競爭優勢理論中的「鑽石模型」分析台灣的國家競爭優勢，用五力分析模型做產業競爭分析。對照成功範例-漢微科公司，其關鍵是選對市場、強大的核心技術是競爭優勢，再加上適宜的經營策略。期望以上的研究能為台灣本土半導體設備業帶來啟示，建立並壯大台灣本土半導體設備業。

關鍵字

摩爾定律；超越摩爾定律；策略群組；波特國家競爭優勢；鑽石模型；產業競爭五力分析模型

並列摘要

Taiwan has been developing the Semiconductor industry for more than thirty years, and achieved second ranking in the world. It is very important for Taiwan economics. However, almost of the Semiconductor equipments were imported from overseas. These equipments are crucial to production yield and reliability of Semi-conductor IC. If the Semiconductor equipment enterprises in Taiwan can take part in and form a perfect industrial chain, it would bring excellent profits to Taiwan Semi-conductor and the whole electronic industry. Hermes Microvision Inc. (HMI) is a small enterprise in Taiwan, but creates outstanding values with more than one hundred billions NTD. Above reasons induce the motivation of research for this topic. In this research, the industry structure and developing trend of Semiconductor were analyzed. They really match the points of “Moore’s law” and “More than Moore’s law”. To indentify the markets of Semiconductor equipment, by using the concept of “strategic groups”. To indentify the capability of Taiwan by using the “diamond model” of Porter’s “The Competitive Advantages of Nations”. To use “ Porter five competences analysis ” to analyze the competitive capabilities for this industry. A good case study in reference to HMI whose key points are right market, strong core technology and correct business strategies. Based on above research, key issues would be enlightened for the Semiconductor equipment industry in Taiwan. Therefore, the strong equipment industry would be expected in future.

並列關鍵字

Moore’s law ； More than Moore’s law ； Strategic groups ； Competitive Advantages of Nations ； Diamond model ； Porter five competences analysis

參考文獻

• John H. Lau (2011). Evolution, challenge, and outlook of TSV, 3D IC integration and 3D silicon integration. Electronics & Optoelectrics Research Laboratory, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan.

• Douglas Yu(2015). A New Integration Technology Platform:Integrated Fan-Out Wafer-Level-Packaging for Mobile Applications. 2015 Symposium on VLSI Technology Digest of Technical Papers.

• Christianto C. Liu. High-Performance Integrated Fan-Out Wafer Level Packaging (InFO-WLP):Technology and System Integration. IEDM12-326, 2012 IEEE.

• Hao Chen(2014). Wafer Level Chip Scale Package Copper Pillar Probing. INTERNATIONAL TEST CONFERENCE, 2014 IEEE.

• Charles W. L. Hill, Gareth R. Jones, Melissa A. Schilling, “Strategic Management: Theory”11th edition, 2015.

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半導體設備產業廠商經營策略分析--以漢微科公司為例

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