電容感測電路之設計模擬與佈線

The Design Simulation and Layout of Capacitive Sensing Circuit

黃韋皓(Wei-Hao Huang)

指導教授 ： 張家歐

國立臺灣大學/工學院/應用力學研究所/碩士(2007年)

https://doi.org/10.6342/NTU.2007.01888

摘要

本論文的目的在實現電容式感測器之佈局，並且比較佈局前後之性能變化，文中介紹佈局之技巧與通則以及電阻及電容的佈局方式，並以隔離環阻隔寄生電容效應，對差動電路以對稱性消除雜訊，最後模擬佈局後電容改變量和電壓輸出之關係，此電路佈局之解析度可達 法拉等級。
而本論文使用國家晶片系統設計中心(NSC Chip Implementation Center, CIC)所提供的台灣積體電路(TSMC)0.35μm Mixed-Signal 2P4M Polycide 3.3/5V的製程，並使用Synopsys 公司所出的Hspice電路模擬軟體進行模擬以及思源公司的laker軟體進行佈線。

關鍵字

電容感測器 ； 類比積體電路 ； 全差動式感測電路 ； IC設計 ； 佈局

並列摘要

The purpose of this dissertation is to realize the design and layout of capacitive sensing circuit, and in this case to compare the differences before and after layout. In this dissertation presents the skills and principles of layout, and also the method of designing resistance and capacitor. Furthermore, using guard ring to shield noise effect, and using symmetry to eliminate the noise of differential circuit, at the end of this dissertation is to simulate the relations between variety of capacity as well as output voltage after layout. The circuit after layout has the best resolution which is up to 1fF.
This dissertation is applying 0.35μm Mixed-Signal 2P4M Polycide 3.3/5V manufacture process of TSCM which is provided by NSC Chip Implementation Center. Finally, using Hspice software designed by Synopsys co. to simulate and laker software designed by Springsoft co. to layout.

並列關鍵字

capacitive sensor ； analog integratd circuit ； full differential sensing circuit ； IC design ； layout

參考文獻

(19) 陳世昌 , “位移電容感測器之研究設計”, 國立台灣大學應用力學研究所, 碩士論文, 2006.

(2) B.Mihang, W.Weiyuan, “Future of microelectromechanical systems(MEMS),” Sensors and Actuators, A56, pp.135-141, 1996.

(3) M.A. LEMKIN et al, “A 3-axis force balanced accelerometer using a single proof-mass,” Solid State Sensors and Actuators, Vol. 2, pp.1185-1188, 1997.

(7) M. Kraft, C. Lewis, T. Hesketh and S. Szymkowiak, “A novelmicromachined accelerometer capacitive interface”, Sensors and Actuators A68 ,pp. 466-473, 1998.

(10) B. E. Boser and R. T. Howe, “Surface Micromachined Accelerometer,” IEEE Journal of Solid-State Circuits, Vol. 31, No. 3, 1996.