隨著半導體製程技術的蓬勃發展,微機電技術日趨成熟,並可與積體電路整合發展成一系統晶片(SOC)於以提升性能,並可降低在製作上的成本,而本論文的目的為實現陣列式訊號處理電路之設計與佈局,並且比較佈局前後的性能變化。最後使用標準CMOS製程將陣列壓阻式力量感測器與其訊號處理電路整合於同一晶片中,使其可應用在晶圓級的探針卡的線上即時探針之狀態監測。由量測結果可知所設計的運算放大器可應用於訊號放大之用,以及定址訊號可正確控制各感測器上所裝置的類比開關。 本晶片使用國家晶片系統設計中心(NSC Chip Implementation Center, CIC)所提供的台灣積體電路(TSMC)0.35µm Mixed-Signal 2P4M Polycide 3.3/5V的製程,並使用Hspice電路模擬軟體進行模擬和Laker軟體進行佈局。
With the advent and rising development of semiconductor technology, MEMS technology also comes to maturity, and can be integrated together with IC to fabricate a system chip (SOC) to enhance the performance and get cost-down in fabrication. The purpose of this paper is to realize the design and layout of array type signal process circuits, moreover to compare the differences of performance between pre-sim and post-sim. Finally, this study integrates array type piezoresistive force sensor with signal processing circuitry in the standard CMOS technology, and lead its application to on-line real-time monitor the contact force of probe card. We prove the design of operational amplifier can be applied to amplify signal and the specific signal can control analog switches on each sensor accurately from measurement results. The chip design was based on 0.35μm Mixed-Signal 2P4M Polycide 3.3/5V Manufacture process of TSMC provided by NSC chip Implementation Center. Finally, Hspice software was employed to simulate the circuit and Laker software was used to implement layout.