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  • 學位論文

製造業的價值創造:台積電開放創新平台之個案研究

Value Creation From A Manufacturing Company: A Case Study of TSMC Open Innovation Platform

指導教授 : 郭瑞祥
共同指導教授 : 廖咸興

摘要


自1960年代電晶體由美國貝爾實驗室研發以來,半導體產業已歷經六十多年的蓬勃發展,演變成一個攸關民生、經濟、國防的重要產業。以2021年來說,全球半導體市場規模已經達到5,509億美元(550 Billion USD),展望2022年,預估全球市場規模將高達6,065億美元。 回顧半導體產業六十年的發展歷史,至少有三個明顯的階段。第一個階段,稱之為IDM(Integrated Device Manufacturer),中文稱之為整合元件製造。在這個階段,大公司從設計到製造一手包辦,是典型的垂直整合模式。第二個階段,是所謂的ASIC(Application Specific Integrated Circuit),中文稱之為特定應用積體電路。在這個階段,設計工作被獨立出來,成為小型的公司,與IDM競爭,但仍需要IDM的製造服務。第三個階段,稱之為Foundry(獨立晶圓廠),也就是所謂的專業晶圓代工時代。在這個階段,設計公司的成品不再由IDM製造,而交給獨立晶圓廠生產製造。至此,半導體產業從完全的垂直整合,進入了高度分化的垂直分工。 然而,由於先進製程的高度技術密集,極致的分工也帶來了許多挑戰。因應這些問題與挑戰,台積電創立Open Innovation Platform(OIP),開放創新平台,開啟了半導體業建立生態系的先驅。而這次的命題,是協作。 本研究以製造業的價值創造為主軸,探討台積電開放創新平台所解決的產業問題,和此平台對產業及台積電本身的積極意義。本研究發現,即使在極端競爭的半導體產業,回歸企業的核心價值、持續創新、和與生態系的共榮共生,將會是台積電持續成功的不二法門。

並列摘要


Since Bell Labs invented the transistor in the 1960s, the semiconductor industry has had more than sixty years of hyper growth, pervading into our daily lives, as well as and many other aspects of the economy. In 2021, the global semiconductor market had reached 550 billion USD. Forward looking into 2022, the number will grow to as high as 606 billion. Retrospectively over the past sixty years, there are at least three major development stages of the semiconductor industry. The first is the IDM (Integrated Device Manufacturer) stage. There big companies handled the IC design tasks all the way to manufacturing, forming a typical vertical integrated model. The second stage is the ASIC (Application Specific Integrated Circuit) stage. There the IC design job was separated out to smaller design houses, while the finished design still requires IDM’s manufacturing service. In the third stage, pure-play semiconductor foundry emerged, and instead of sending to the IDM, the IC design was redirected to the foundry for manufacturing. Till this stage, the semiconductor industry had migrated from vertical integration, to a high degree of vertical specialization. However, as the advanced node process becomes more and more difficult, the high degree of vertical specialization does impose new challenges. To cope with such challenges, TSMC created Open Innovation Platform (OIP) and pioneered the semiconductor eco-system concept. This time, the key focus is collaboration. This dissertation centered around the value creation of a manufacturing company, and discuss the TSMC Open Innovation Platform and the solution it provides. Through this research, we found that even under fierce competition in the semiconductor industry, the key elements to continued success can still be resorted back to the corporate core value, the relentless drive of innovation, and the prosperation of the eco systems.

參考文獻


一、中文文獻
1. 亨利.伽斯柏Henry W. Chesbrough,安德魯.嘉曼Andrew R. Garman,“開放式創新五大行動 How Open Innovation Can Help You Cope in Lean Times”,哈佛商業評論,2009年12月號
2. 麥可.賈各比德Michael G. Jacobides,“迎接生態系統經濟,企業有何策略?In the Ecosystem Economy, What's Your Strategy?”,哈佛商業評論,2019年9月號
3. 馬歇爾.范歐斯丁Marshall W. Van Alstyne,傑佛瑞.帕克Geoffrey G. Parker, 桑吉特.保羅.喬德里Sangeet Paul Choudary,“平台經濟新遊戲規則”,哈佛商業評論,2016年4月號
4. 中央社,“歐洲推晶片法,官員:若無台灣,全球工廠3週關閉”,科技新報,2022年2月10日

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