迴路式熱虹吸蒸氣腔體之研究

Investigation and Analysis of the Loop Type Thermosyphon Vapor Chamber

張顥瀚(Hao-Han Chang)

指導教授 ： 陳希立

國立臺灣大學/工學院/機械工程學研究所/碩士(2004年)

https://doi.org/10.6342/NTU.2004.01532

摘要

隨著科技的日新月異，電子產品不斷朝向高性能、高能量、高處理速度進展，晶片組因密度過高而產生散熱的問題與管理，乃成為設計或研發產品時重要的一個環節。本硏究主要在分析新一代電子冷卻散熱模組－－迴路式熱虹吸蒸氣腔體（Loop Type Thermosyphon Vapor Chamber, LTSVC）的性能表現。迴路式熱虹吸蒸氣腔體系統包括蒸發器、升流管段、冷凝器與降流管段。迴路式熱虹吸蒸氣腔體主要是利用系統蒸發器內部工作流體，在操作時吸收熱量產生蒸發或沸騰的相變化，所產生的蒸氣經由聯結管路帶至冷凝器凝結，並將熱迅速由冷凝器散逸至外界。由於過程之中，沸騰與凝結的熱傳遞係數很高，所以該系統可在很小的溫度梯度之下，散逸大量的熱。研究中，首先建立系統的熱阻模型，藉由性能實驗分析加熱必v、填充量與沸騰表面型式對系統散熱性能的影響。系統所選用的工作流體為水，研究發現，系統總熱阻、蒸發器熱阻以及冷凝器熱阻皆隨加熱必v增大而減小，顯示該系統在高加熱必v有比較好的散熱性能表現。填充量主要影響冷凝器熱阻，對於系統而言，將存在有一最佳填充量，而不同的強化沸騰表面型式則影響沸騰的熱傳遞係數。研究中除了分析迴路式熱虹吸蒸氣腔體的性能實驗結果與現象，並針對系統的實驗結果，以Rohsenow與Nusselt的沸騰與凝結之經驗公式加以分析，提出符合本系統的半經驗公式，以利未來對於系統進一步的分析與改善。

關鍵字

平板型蒸發器 ； 電子冷卻 ； 蒸氣腔體 ； 熱虹吸管

並列摘要

As science and technology progress, electronic products are highly powered and have higher performance and high processing speed. The thermal dissipation managements and problems of the chipset caused by high density of transistors, become an important segment of products design or research. This thesis analyses the performance of the new electronics cooling heat dissipation module – loop type thermosyphon vapor chamber (LTSVC). A LTSVC has an evaporator, a riser, a condenser, and a downcomer. When the LTSVC operates, it utilizes the phase change of working fluid in the evaporator to bring heat to the condenser via the riser. The heat is then released to environment rapidly, and vapor is condensed back into liquid. The heat transfer coefficients of boiling and condensation are so high that the system can dissipation lots of heat via low temperature gradient. The thermal resistance module is established in this research, and the influences of the heating power, the filling volume, and the type of the boiling surfaces are analysed in virtue of performance experiments. The working fluid is water. The results indicate that the system’s total resistance, evaporator resistance, and condenser resistance are decrease as the heating power increase. Thus shows that the system performs well when the heating power is high. The filling volume influences the condenser resistance. Therefore there should be a best filling volume of the system. The different boiling surfaces influence the heat transfer coefficient of the boiling. Besides the analyses of the experiment and performances, another goal is to find suitable half experience correlations for the system by using of the experiment results and according to Rohsenow’s experience correlation and Nuseelt’s module.

並列關鍵字

Vapor Chamber ； Thermosyphon ； Plate Evaporator ； Electronics Cooling

參考文獻

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