兩相封閉迴路式熱虹吸散熱系統

Two Phase Close Loop Thermosyphon Cooling System

蕭惟哲(Wei-Che Hsiao)

指導教授 ： 陳希立

國立臺灣大學/工學院/機械工程學研究所/碩士(2005年)

https://doi.org/10.6342/NTU.2005.01055

摘要

隨著電子工業的發展，電子產品不斷朝著高性能、小體積的方向發展，然而其單位面積的發熱量卻是越來越高，因此也就產生散熱方面的問題，早期解決的方法為利用鰭片加上風扇來解決，然時至今日，此方法已無法解決即將出現的下一代新型電子設備，故乃需要使用其他方法來解決新一代的電子設備散熱問題。因此本研究探討以水為工作介質時，兩相封閉迴路熱虹吸式散熱系統(Two Phase Close Loop Thermosyphon Cooling System )在不同參數下，整體的散熱性能表現，兩相封閉迴路熱虹吸式散熱系統包含了蒸發器、冷凝器與絕熱管段，其工作原理主要是利用在蒸發器內的工作流體吸收熱量，藉由蒸發或沸騰的機制產生相變化成為氣態，經由絕熱管段抵達冷凝器並將熱藉由冷凝器迅速地傳至外界後凝結成為液態。本研究探討以切削溝槽板、蝕刻板、以及燒結板三種不同類型之強化沸騰表面結構為主之蒸發器搭配垂直形式之冷凝器，在各充填量與加熱率下的性能表現，再與前人比較冷凝器形式之差異對系統性能之影響，以作為未來之改進方向。研究發現，系統總熱阻、蒸發熱阻、及冷凝熱阻大致上皆隨著加熱功率的上升而減小，顯示本系統適用於高發熱功率之電子元件散熱；且當強化沸騰表面為燒結板、工作流體充填量為15%，此時蒸發器內產生以薄膜蒸發為主的相變化機制，因此本系統會有最佳之性能表現。

關鍵字

熱虹吸 ； 強化沸騰表面 ； 薄膜蒸發

並列摘要

With the development of electronic industry, electronic components keep going for high performance and small volume. Since the heat in unit area is getting higher and higher, the problem of cooling appears. In early days, people solve these problems with fins and fans, but this method won’t work for the electronic components of next generation. So we have to solve the problem of cooling the electronic components of next generation in other ways.
In the research, we studied the performance of Two Phase Close Loop Thermosyphon Cooling System under different parameter with water as working fluid. There are evaporator, condenser, and adiabatic section in the system. The working fluid in the evaporator absorbs the heat from the electronic components and changes its phase to vapor by the mechanism of evaporation or boiling. Then the vapor goes through adiabatic section to the condenser to release the heat and condense. There are three enhanced surfaces-grooved surface, etched surface, and sintered surface with vertical condenser for the system. We studied the performance of these three surfaces under different filling ratio and power. Then compared the performance of condenser with Chang’s[29]. In the research, it was found that the total thermal resistance, evaporator thermal resistance, and condenser thermal resistance are all going down with the increasing power. It says that the system is suitable for cooling the electronic components of next generation. And we also found that because of thin film evaporation, the system will have the best performance at 15% filling ratio with sintered surface.

並列關鍵字

Thermosyphon ； Boiling Enhancement ； Film Evaporation.

參考文獻

29. 張顥瀚，「迴路式熱虹吸蒸氣腔體之研究」，碩士論文，國立臺灣大學機械工程學研究所，民國九十三年六月（2004）。

4. Maydanik, Yu. F., "Loop Heat Pipes – Development and Application," the SEMINAR of Department of Mechanical Engineering National Taiwan University, Oct. 2003.

5. Murthy, S. S., Joshi, Y. K. and Nakayama, W., "Single Chamber Compact Thermosyphons with Micro-Fabricated Components," Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems (I-Them), Las Vegas, NV, May 2000.

7. Ramaswamy, C., Joshi, Y. K. and Nakayama, W., "Thermal Performance of a Compact Two-Phase Thermosyphon: Response to Evaporator Confinement and Transient Loads," Journal of Enhanced Heat Transfer, Vol. 6, No. 2-4, pp. 279-288, 1999.

8. Ramaswamy, C., Joshi, Y. K., Nakayama, W. and Johnson, W. B., "Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon," IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, Mar. 2000.