CMOS-MEMS製程電容式正反面指向性麥克風

CMOS-MEMS製程設計電容式正面以及反面麥克風陣列，CMOS-MEMS製程可以達到微小化、低成本及大量生產之優點，同時也易於與一般IC電路相容整合，形成微機電系統。本研究提出一種設計方法可以將兩種不同的麥克風結構製作在同一晶片上，並設計一種製程方法可同時將兩種不同結構的麥克風製作完成，且可與CMOS電路整合形成麥克風晶片，再經由後續的訊號聲音處理以及覆晶封裝技術來達成指向性麥克風。模擬藉由Coventor Ware模擬軟體分析麥克風薄膜結構，包括薄膜中心位移量、初始電容值、電容值變化量、吸附電壓、以及應力最大區域；後製程利用乾、溼蝕刻製程完成麥克風陣列的製作。

關鍵字

CMOS ；微機電；指向性；微麥克風陣列

並列摘要

CMOS-MEMS process can achieve miniaturization, low cost and mass production, because the CMOS-MEMS process can integrate general IC process and IC circuit to become Micro-Electro-Mechanical-System. This study provides a design way to combine two different microphone structures on the same chip and then design a process to make two different microphone structures be finished in one time, moreover, after two microphone structures are finished to combine CMOS circuit become micro-chip which is CMOS-MEMS capacitive microphone. Simulation by Coventor Ware to simulate microphone membrane, membrane deflection, initial capacitance and capacitance change. This process use dry-etch, wet-etch and CO2 Supercritical Dry Release to finish this study.

並列關鍵字

CMOS ； MEMS ； directional ； Microphone array

參考文獻

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CMOS-MEMS製程電容式正反面指向性麥克風

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