CMOS-MEMS製程是直接從一般IC製造中的CMOS製程加上微加工技術,使其具有機械特性,因此利用CMOS-MEMS製程來製作微機電元件,不僅可以有一般微機電加工技術的優點,同時也因為可與一般IC製程相容,易於與IC電路整合,形成微機電系統。 本論文是利用CMOS標準製程與微機電後製程研製電容式微加速度計及微麥克風,並提出新的製程方法及結構,且可與CMOS製程及電路整合之晶片;同時藉由CoventorWare模擬分析軟體針對三軸微加速度計及微麥克風結構做改良設計;最後利用CIC所提供的RLS後製程以及乾、溼蝕刻製程步驟達到加速度計與麥克風結構的建立。
CMOS-MEMS is composed of CMOS process from IC fabrication and MEMS. The elements based on CMOS-MEMS have the mechanical properties. Therefore, using CMOS-MEMS process for MEMS elements not only has the advantages of MEMS but also has the compatibility with IC fabrication. Moreover, the elements which are fabricated by CMOS-MEMS are easy to integrate with IC circuits. The study was using the standard CMOS process and MEMS post-process to develop the capacitance accelerometer and microphone. Besides, we demonstrated new processes for fabrication and new structures which could be fabricated by CMOS and be integrated with circuits on one chip. Meanwhile, we used the simulation software, ConvetorWare, to optimize the structures of three-axis accelerator and microphone. In the final steps, using RLS post-process which was provided by CIC and dry、wet etching achieved the establishment of the accelerator and microphone.