熱可塑性聚醯亞胺(TPI)之機械/物理特性研究

Study Thermoplastic polyimide (TPI) of machinery /physical characteristic

李謨霖(Mou-Lin Li)

指導教授 ： 程耀毅

國立臺北科技大學/工程學院/有機高分子研究所/碩士(2007年)

https://doi.org/10.6841/NTUT.2007.00355

摘要

本研究針對一系列雙胺單體(diamine monomers)和雙酸酐單體(dianhydride monomers)合成聚醯亞胺，在本研究中將不同之二胺單體搭配不同的二酸酐單體，目的是為了對不同之聚醯亞胺單位結構，其熱膨脹係數(Coefficient of thermal expansion, CTE)、玻璃轉移溫度(Glass transition temperature, Tg)、機械特性作探討，以找尋適用於FPC (軟性電路板)產業的TPI(Thermoplastic polyimide)。本實驗製備之聚醯亞胺材料採用傅立葉轉換紅外光譜儀(FTIR)、熱機械分析儀TMA、萬能拉力機觀察其熱性質及機械性質。

關鍵字

聚醯亞胺 ； 熱膨脹係數 ； 玻璃轉移溫度

並列摘要

In this research a series of polyimides were prepared by different combinations of dianhydride monomers and diamine monomers. Such prepared polyimides were then subjected to systematic examinations on the associated physical properties such as coefficients of thermal expansion (CTEs), glass transition temperatures (Tgs), as well as the significant mechanical characteristics including tensile strengths and elongations. The observed physical and mechanical significances of the prepared polyimides were then analyzed to define the thermoplastic polyimides which are appropriate for the applications in the flexible printed circuit board (FPCB) industry. The structures and surface compositions of the prepared polyimides were characterized by Fourier transform infrared spectrometry (FTIR) and Thermal mechanical analyzer (TMA), and Universal Tensile Tester.

並列關鍵字

Polyimide ； Coefficient of thermal expansion ； Glass transition temperature

參考文獻

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