微三次元量測機之微細球狀探針加工與黏著技術之研究

Study on Micro Spherical Probes Gluing and Fabrication for Micro Coordinate Measuring Machine

黃家科(Jia-Ke Huang)

指導教授 ： 許東亞

國立臺北科技大學/機電學院/製造科技研究所/碩士(2011年)

https://doi.org/10.6841/NTUT.2011.00617

摘要

本論文主要針對目前微三次元量測機（Micro CMM）所面臨之微細球狀探針加工技術進行相關研究。研究中主要利用微放電加工方法製作微細玻璃球狀探針，結合線放電研磨(Wire Electrical Discharge Grinding, WEDG)技術和CNC微放電加工機之位置函數控制，並搭配機台所附屬CCD線上影像量測系統和黏著技術可順利將微細玻璃球裝配於電極工具，之後利用此影像量測系統量測微細玻璃球狀探針之偏心狀況。本研究也利用單發放電技術 (One Pulse Electric Discharge, OPED)製作微細球狀針並與黏著式微細球狀探針相互比較。
研究結果顯示直徑70μm的微細玻璃球狀探針偏心誤差量可控制在2μm內，其黏著力大約可承受至10.5mN。未來隨著定位技術與黏著材料的改善，本研究黏著裝配技術之微細球狀探針，將可應用於微三次元量測機之觸發感測頭上，量測微細零組件。

關鍵字

微放電加工機 ； 微三次元量測機 ； 微細球狀探針

並列摘要

This paper describes fabricating technology to produce micro ball-ended spherical stylus tips for micro CMM’s tactile probing head. The study mainly used micro EDM method to glue and assemble micro glass spherical stylus tips. With combination of Wire Electro Discharge Grinding (WEDG) technology and position controlling function of CNC micro EDM, a micro ball-ended stylus could be assembled onto the front-top of micro electrode tool successfully. CCD in-process measurement was used to measure the profile and roundness of the styli tips. In order to investigate the fabrication characteristics, the study also used One Pulse Electric Discharge (OPED) technology to fabricate metal micro spherical stylus tips. The experimental results show that the roundness of the largest profile micro glass ball-ended stylus tips with diameter 0.07μm is as small as 2μm and adhesive force decreases rapidly at approximately 10.5mN. With the improvement of positional control technology and adhesive material, the gluing and assembling process of micro ball-ended stylus tips could be used on micro CMM’s tactile probing head for micro components metrology in the near future.

並列關鍵字

Micro-EDM ； Micro-CMM ； Micro ball-ended stylus

參考文獻

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