電路板衝擊試驗與有限元素模擬分析

The Impact Test and Finite Element Analysis of Printed Circuit board

藍先進(Hsien-Chin Lan)

指導教授 ： 何旭川

元智大學/工程學院/機械工程學系/碩士(2004年)

摘要

電子產品不論是在運輸過程或使用當中，均無可避免的會遭受外物衝擊，而撞擊所導致的損傷，亦為電子產品破壞之主要原因，耐衝擊實驗為電子產品不可或缺的品質檢驗規範。本文探討電路板及其上之電子零件承受衝擊後之響應，包含加速度、應變與零件接腳應力，衝擊方式為將電路板左右兩邊固定於鋼製基座中間懸空，再將基座升高50mm以自由落體撞擊四個鐵氟龍半圓球。應用ANSYS/LS-DYNA有限元素軟體計算電路板及電子零件衝擊過程之暫態響應，並以掉落實驗機器進行衝擊實驗，藉由貼覆於電路板之加速度規與應變規，量測衝擊過程之加速度與應變，再比較兩者差異性，驗証數值模擬分析之可行性與衝擊實驗之可靠度。ANSYS/LS-DYNA有限元素軟體能提供電子產品設計人員，在開發階段即以數值模擬分析方法瞭解衝擊響應，並據以修改或補強產品之耐衝擊能力，再輔以適當之衝擊實驗驗証，能有效縮短產品開發時程減少測試次數降低成本。本文以電路板為例，所做之數值分析與衝擊實驗，結果亦顯示兩者相當吻合，可有效預測衝擊響應，具相輔相成效果。

關鍵字

電路板 ； 衝擊試驗 ； 有限元素分析

並列摘要

It is not unusual for electronic products subjecting impact during the transportation or operation. The damage induced by the impact is one of the main causes for the failure in electronic products. Thus, impact test is required in most electronic devices. In this investigation, the printed circuit board with electronic components such as transformer, inductor, capacitor, and subjecting impact is analyzed by ANSYS/LS-DYNA finite element software and experimental impact test. The printed circuit board is fixed on a drop table at the height of 50mm, and dropped with free fall to impinge four Teflon semi-spheres. The impact responses such as acceleration, strain and stress determined by the LS-DYNA are compared with the experimental results obtained by the accelerometer and strain gauge. Good agreement between the numerical and experimental results demonstrates that ANSYS/LS-DYNA is capable of predicting the impact response. ANSYS/LS-DYNA provides a useful tool for designers to understand the impact behavior in the design level, therefore reduces the trial test and cost.

並列關鍵字

Printed Circuit board ； Impact Test ； Finite Element Analysis

參考文獻

6. 黃鐳迪, 「薄殼產品落地試驗之研究」, 私立中原大學機械工程研究所, 博士論文, 民國92年。

15. 張智星, 「MATLABE程式設計與應用」, 清蔚科技股份有限公司, 民國91年。

3. Tin Lup Wong, Karl K. Stevens, Gang Wang, ”Experimental Modal Analysis and Dynamic Response with Surface mount Electronic Component”, Journal of Electronic Packaging, Vol.113, pp.244-249, 1991.

4. S. J. Ham and S.B. Lee, ”Experimental Study for Reliability of Electronic Packaging under Vibration”, Experimental Mechanic, Vol.36, No.4, pp.339-344, 1996.

7. 游永豐, 「電子裝置衝擊減振研究」 , 私立元智大學機械工程研究所, 碩士論文, 民國90年。