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  • 學位論文

電子裝置衝擊減振之研究

A Study of Shock Resistant of Electronic Device

指導教授 : 陳永樹
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摘要


近年來由於電子裝置朝向高精密度的趨勢發展,故相對的電子產品之可靠度要求也益形重要。本研究即針對衝擊對電子產品造成之影響,提出改善的方法,並經由理論與實驗之驗證,提高其可靠度。 高密度構裝技術的進步,使得各種攜帶式電子產品,如:行動電話、無線電話、呼叫器、筆記型電腦、硬式磁碟機、數位相機等之普及率日益升高。而此類電子產品常因為人們的疏忽或在製造的過程中掉落地面,造成內部電子元件的破壞與失效。故分析這些電子產品對於受到衝擊時之響應情形,為本研究之重點。 而分析之方法,則為就電子產品之摔落情形與受各種衝擊脈衝波的影響,分別以理論與實驗探討之。理論方面,以能量法與自由落下雙自由度具阻尼、不具阻尼彈簧-質量系統建立電子裝置之數學模式,而實驗則以標準之衝擊測試機台施加力量測其衝擊響應。並進一步的對於減振理論與減振材料進行研究探討,再利用頻譜分析探究吸振器與結構之相互關係。本研究結合理論與實驗驗證,將可對電子裝置之抗衝擊設計,提供一有效之設計、分析模式。

並列摘要


In recent years, the reliability of electronic products is getting more and more important due to the high packaging density for today''s electronic devices. This study will focus on the response of electronic products under shock loading and investigate the methods of increasing the product reliability to resist shock or impulse loads by both the theoretical and experimental approaches. Because of the progress of the technology of high-density packaging, various portable electronic products, such as mobile phones, wireless phones, beepers, notebooks, hard-disks, digital cameras...etc., have become more and more popular. The failure of such electronic devices usually results from the drops onto the ground during the manufacturing or shipping processes or under users’ application. Therefore, investigation of the response for these electronic products when subjected to shock loading is the key step in improving their reliability. The study examines the effects of various pulse waves and the drop height effects applied on electronic products experimentally. A two-degree-of-freedom damped and undamped spring-mass system is presented as the theoretical model. The interactions between the absorber and the structure is also analyzed through the frequency response functions. It is believed that through these procedures, the methodology of designing a shock resistant electronic device is presented completely.

參考文獻


3. Tin Lup Wong, Karl K. Stevens, Gang Wang, “Experimental Modal Analysis and Dynamic Response with Surface Mount Electronic Component”, Journal of Electronic Packaging, Vol.113, pp.244-249, 1991.
4. S. J. Ham and S. B. Lee, “Experimental Study for Reliability of Electronic Packaging under Vibration”, Experimental Mechanics, Vol.36, No.4, pp.339-344, 1996.
5. S. Kannappan and V. Kunukkassril, “Structural Analyses of Spacecraft Electronic Packages”, Journal of Electronic Packaging, Vol.114, pp.96-99, 1992.
10. R. F. Keltie and K. J. Falter, “Guidelines for the Use of Approximations in Shock Response Analysis of Electronic Assemblies”, Transactions of ASME: Journal of Electronic Packaging, Vol. 115, pp.124-130, March 1993.
11. E. Suhir, “Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to its Supported Contour”, Transactions of ASME: Journal of Electronic Packaging, Vol. 114, December 1992.

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