灌注成形用之樹脂成份調配與研究

The Modification of Epoxy Resin for Resin Transfer Molding

楊政道(Yang, J. D.)

指導教授 ： 洪信國

元智大學/工程學院/化學工程與材料科學學系/碩士(1995年)

摘要

中文摘要： 本研
究探討灌注成形（ RTM ）之環氧樹脂配方和配方系統之 改質。利
用傅立葉轉換紅外線光譜儀（FTIR）、熱差分析儀 （DSC）、熱
重分析儀（TGA）對商用灌注成形用之樹脂加以 分析並當成參考
樹脂。由 FTIR 得知Araldite LY-564 為雙酚-A 型（DGEBA）類之環
氧樹脂再加入低黏度之稀釋劑，而硬化 劑 HY-2954 為脂肪族胺
類。從 DSC 分析出之硬化動力顯示此 樹脂系統必須以 120℃ 以上
之溫度來進行後硬化才能使反應 完全。計劃中以數種環氧樹脂和
不同之硬化劑形成改質配方， 所選定之硬化劑和改質劑有 TETA、
DETA、DDM 和 ERL- 4206 ，形成硬化劑之配方在室溫下甚穩
定。環氧樹脂部分採 用低黏度環氧樹脂（Araldite-6004）、
DGEBA類之Epon-828 和雙官能環氧樹脂基稀釋劑（ERL-4206）。
配方系統利用 DSC、TGA、Brookfield 黏度計和接觸角測量儀
來進行分析。 五種配方均證實具有低黏度、適合之硬化速率、良
好的熱安定 性及良好的浸潤性，可以成功的使用在 RTM 上，且價
格較商 用樹脂便宜。

關鍵字

灌注成形 ； 環氧樹脂

並列摘要

Abstract

The epoxy systems used resin transfer molding were studied. The
commercial RTM resin was analyzed by Fourier transform infrared
spectroscopy (FTIR), differential scanning calorimetry (DSC),
and thermogravimetric analyzer (TGA), and was served as a
reference. The commercial Araldite LY-564 is a diglycidyl
ether of bisphenol-A resin (DGEBA) with low viscosity
diluent, and HY-2954 is an aliphatic amine according
to FTIR analyses. The curing Kinetics obtained from DSC
analysis indicated that a post-cure at temperature higher
than 120℃ was necessary for the fully cured commercial
system. Various epoxy and curing resin were also formulated and
analyzed. The preliminary curing system were based on the adduct
of triethylene-tetramine (TETA)(or diethylene-triamine
(DETA)), ERL- 4206, and diamino diphenylmethane（DDM）.The
formulated curing system were stable at room
temperature for at least three months. The final formulated
epoxy system consisted of the low viscosity epoxy resin
(Araldite-6004), a DGEBA resin (Epon-828), and a difunctional
cycloaliphatic epoxide diluent (ERL-4206). The formulated system
were also analyzed by DSC, TGA, Brookfield viscometer, and
contact angle goniometer. Five tested systems were proven to
have low viscosities, reasonable curing speed, good
thermal stabilites, and good wetting behavior. They were
successfully used in molding RTM parts. Moreover, they are
much cheaper than the reference material. Further
modifications and studies of these preliminary resin systems
are still in progress.

並列關鍵字

RTM ； Epoxy