灌注成形用之樹脂成份調配與研究

The Modification of Epoxy Resin for Resin Transfer Molding

楊政道(YANG, J. D.)

指導教授 ： 洪信國

元智大學/工程學院/化學工程與材料科學學系/碩士(1995年)

摘要

Abstract
The epoxy systems used resin transfer molding were studied. The
commercial RTM resin was analyzed by Fourier transform infrared
spectroscopy (FTIR), differential scanning calorimetry (DSC),
and thermogravimetric analyzer (TGA), and was served as a
reference. The commercial Araldite LY-564 is a diglycidyl
ether of bisphenol-A resin (DGEBA) with low viscosity
diluent, and HY-2954 is an aliphatic amine according
to FTIR analyses. The curing Kinetics obtained from DSC
analysis indicated that a post-cure at temperature higher
than 120℃ was necessary for the fully cured commercial
system. Various epoxy and curing resin were also formulated and
analyzed. The preliminary curing system were based on the adduct
of triethylene-tetramine (TETA)(or diethylene-triamine
(DETA)), ERL- 4206, and diamino diphenylmethane（DDM）.The
formulated curing system were stable at room
temperature for at least three months. The final formulated
epoxy system consisted of the low viscosity epoxy resin
(Araldite-6004), a DGEBA resin (Epon-828), and a difunctional
cycloaliphatic epoxide diluent (ERL-4206). The formulated system
were also analyzed by DSC, TGA, Brookfield viscometer, and
contact angle goniometer. Five tested systems were proven to
have low viscosities, reasonable curing speed, good
thermal stabilites, and good wetting behavior. They were
successfully used in molding RTM parts. Moreover, they are
much cheaper than the reference material. Further
modifications and studies of these preliminary resin systems
are still in progress.

關鍵字

灌注成形 ； 環氧樹脂 ； 化學工程 ； 化學

並列摘要

無資料

並列關鍵字

RTM ； Epoxy ； CHEMICAL-ENGINEERING ； CHEMISTRY