擴散熱阻於電子構裝之分析與應用

The Analysis and Application of Spreading Resistance in Electronic Packaging

賴美錵(Mei-Hua Lai)

指導教授 ： 林育才

元智大學/工程學院/機械工程學系/碩士(2001年)

摘要

在電子構裝中隨著功率的增加以及構裝尺寸的減小，因此在散熱的控制上，元件的特性已經成為構裝發展的重心。在印刷電路板中元件特性通常包含了元件熱阻及主基板或電路板中心擴散熱阻。
本篇論文即是利用數值分析方法來了解下列參數對擴散熱阻的影響，如晶片的位置、晶片的尺寸、基板的尺寸，和不同的邊界條件。
結果顯示晶片放置位置以基板中心為最佳，晶片熱功率固定時，晶片尺寸的越大熱阻越小。基板面積加大也有助於熱的擴散，而且面積相同時，正方形的基板熱阻比長方形基板的擴散熱阻小。
將自然對流的邊界條件改為強制對流的邊界條件，也可以使溫度大幅降低。相較於以往文獻中大都為等溫的邊界條件，因為這樣的假設較不適用於實際的狀況，因而有較大的誤差存在。

關鍵字

擴散熱阻 ； 電子構裝

並列摘要

In thermal controls of electronic components associated with increasing power densities and decreasing package size, device characterization has become the central part of package development.
Device characterization often includes the modeling of the device thermal resistance via accurate assessments of the chip/die spreading resistance and the spreading resistance in the printed circuit board (PCB).
In the thesis many factors such as the position of the chip, the size of the chip, the size of the base plate, and the corresponding boundary conditions associated with the spreading resistance in the PCB are studied by numerical methods.
The results show that the best chip position is at the center of the base plate. With the chop power fixed, the thermal resistance decreases with the increasing of chip size. The thermal resistance of a square base plate is much higher than that of rectangular base plate .
Under the condition of force convection, the temperature field is much lower than that of nature convection condition.

並列關鍵字

spreading resistance ； electronic packaging

參考文獻

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3.K. J. Negus, M. M. Yovanovich and J. V.Beck, ”On the Non-dimensionalization of Constriction Resistance for Semi-infinite Heat Flux Tubes”, Transactions of the ASME, Vol.111, aug.1989, pp. 804-807.

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