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  • 學位論文

導熱膠片與絕熱材料熱傳導係數量測之可靠度分析

The reliability analysis of thermal conductivity measurement at Thermal Pad and Thermal insulated materials

指導教授 : 林唯耕
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摘要


摘要 在電子構裝散熱中,為了降低散熱模組與發熱源的表面接觸熱阻,故需要使用熱介面材料(Thermal Interface Material, T.I.M.)把CPU所產生的高熱有效的帶走以達到散熱的目的,本實驗室所開發建立一套熱介面材料量測系統,此系統可精準量測出熱介面材料之性質。本論文主要目的在藉由此一熱介面材料量測系統量測分析導熱膠片與絕熱材料之熱傳導性質。絕熱材料已是能源開發、節約工程的重要組成,是與生態、環境保護和可持續發展密切相關的行業,針對絕熱材料之熱傳導性質分析研究對未來能源工程必然是重要的依據。實驗結果在Thermal Grease與Thermal Pad上都有相當好的準確性,故利用此一熱介面材料量測系統量測分析絕熱材料之熱傳導性質,在理論模組建立上可避免因絕熱材料之表面接觸熱阻造成測量結果的影響並且求得該材料之真實熱傳導係數。 本論文實驗分為三大部分:第一部分為T.I.M.量測平台的穩定性分析,第二部份為利用T.I.M.量測平台實驗分析Thermal Pad之熱傳導性質,第三部份為利用T.I.M.量測絕熱材料熱傳導性質實驗分析。 由實驗結果可以發現, 在Thermal Grease量測部分T.I.M.量測平台所量測出道康寧TC-5121及信越7762熱傳導係數重複性相對誤差皆在1%以下。在Thermal Pad量測部分利用SAINT-GOBAIN先進材料公司所委託14種樣品,以及崇越科技的1種樣品測試,在這15個樣品測試中重複性與再線性相對誤差皆在10%以下,故本量測平台具有良好的穩定性與準確性。因此使用此量測平台測量絕熱材料之熱傳導性質。利用已知性質之電木、鐵氟龍等材料測量進行比對,絕熱材料在控制不同厚度下所量測之材料熱阻值亦有所不同,隨著材料厚度增加其所對應之總熱阻值相對遞增,由實驗結果得知若將絕熱材料試片厚度控制在1.5mm以下時,T.I.M.量測平台所測量出的絕熱材料之熱傳導係數與文獻參考值之相對誤差皆在10%以下,顯示此一熱介面材料量測系統無論在導熱膠片及絕熱材料量測上,皆具有相當好的穩定性與準確性。

關鍵字

散熱膏 導熱膠片 絕熱材料

並列摘要


Abstract In order to reduce the thermal resistance contact from thermal modules and heat source, we need to use thermal interface material (Thermal Interface Material, TIM) to effectively remove the heat which is generated by the CPU and achieve the purpose of cooling. Developed in our laboratory, we establish a measurment system for the measurment of thermal interface materials. This system can accurately measure the properties of thermal interface materials. The main purpose of this paper is to gauge and analyze the thermal conductivity of thermal pad and insulation materials by using the TIM measurment system. Thermal conductivity analysis of insulation materials must be a very important basis of energy engineering in the future. The results can be found in the following experiments. The relative error of thermal conductivity’s repeatability were less than 1% when measuring Thermal Grease ( using Dow Coning TC-5121 and Shin-Etsu 7762 ) by TIM measurement system. When measuring 15 kinds of Thermal Pad’s thermal conductivity ( using 14 kinds of samples from the SAINT-GOBAIN Advanced Materials (Taiwan) Co.,Ltd and one from the TSC ).We can found that the relative error of repeatability and reproducibility were below 10%. As mentioned above, TIM measurement system has high stability and accuracy. Therefore, we use TIM measurement system to gauge and analyze the thermal conductivity of insulation materials. Measure and compare some materials, such as bakelite and teflon, which their thermal conductivity properties had been known. The experimental results shows that we control the thickness of insulation material below 1.5mm, the relative error of thermal conductivity which was gauged by the TIM measurement system, and the theoretical value will less than 10%. These results also indicated that this TIM measurement system have high stability and accuracy in measureing Thermal Pad and insulation materials.

參考文獻


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被引用紀錄


趙少君(2013)。以氮化物為填充物之高熱傳熱介面材料之研發〔碩士論文,國立清華大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0016-2511201311335277

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