熱介面材料（T.I.M.）之K值測定與靈敏度分析

Thermal Conductivity and Sensitivity Analysis of Thermal Interface Material

傅裕修(Yu-Hsiu Fu)

指導教授 ： 林唯耕 ； 傅應凱

國立清華大學/原子科學院/工程與系統科學系/碩士(2007年)

https://doi.org/10.6843/NTHU.2007.00036

摘要

目前，電腦所使用之散熱元件皆脫離不了散熱模組，但更嚴格來講，更應包括熱源表面與散熱模組間之ㄧ種導熱性質良好的熱介面材料（Thermal Interface Material, T.I.M.），效能好的T.I.M.可以大幅降低熱源表面與散熱模組間的介面熱阻，為了得到最佳化的選擇，我們必須精確的量測出T.I.M.的熱性質。截至目前為止，沒有任何理論模式可以預測T.I.M.的熱性質，所以精準的測量平台和方法是相當重要的。本論文主要目的，在建立一套熱介面材料熱性質量測系統，以一維熱傳導理論為基礎，加上精密加工技術，針對電腦所使用之熱介面材料，發展出一套製作低成本、高準確率之熱性質量測系統。
　　本論文實驗分為四大部分。第一部分在探討不同厚度spacer對實驗靈敏度（sensitivity）的影響；第二及第三部分則是就實驗的重複性（repeatability）及再現性（reproducibility）進行分析討論；最後，則是以國立清華大學工程與系統科學系電子構裝散熱實驗室所設立之Dummy Heater熱阻測試機驗證T.I.M.量測系統。經由實驗結果，我們可以發現，本論文實驗所設計之ABS spacer有較佳之靈敏度表現，熱傳導係數重複性相對誤差在5％以內；接觸熱阻值重複性相對誤差也在10％左右；不同操作者所造成的再現性相對誤差更在2％以內，經由Dummy Heater熱阻測試機進行驗證，其準確率與可靠度更是無庸置疑。

關鍵字

熱介面材料 ； 熱阻 ； 接觸熱阻 ； 熱傳導係數

並列摘要

At present, all the heat dissipation elements used in computer would be include heat sink, fan or heat pipe etc. Strictly speaking, the Thermal Interface Material (T.I.M.) should be account into too. A good T.I.M. could reduce largely the thermal resistance between heat source and the heat sink. In order to obtain the optimal selection, we need to measure the thermo properties of the T.I.M. very accuracy. The purpose of this paper is to build up a very high sensitivity T.I.M. measuring system which was based on one-dimension heat transfer theory and the precise processing technology.
　　This article includes four parts, the first one is to discuss the effect of the different thickness of the spacer to the sensitivity of the instrument, the second part and the third part was discussing the repeatability and the reproducibility respectively. The fourth part was used dummy heater developed by ECS laboratory to evaluate the thermo resistance value of the grease and double check was that consistence evaluate from T.I.M. instrument. The experiment results showed that the ABS spacer developed by ECS laboratory a very good sensitivity performance. The relative error of the conductivity coefficient from the repeatability experiment was within 5%, while the relative error for the contact resistance was within 10%. The relative error of the reproducibility made by different operator was control within 2%.

並列關鍵字

Thermal Interface Material ； T.I.M. ； Thermal Resistance ； Contact Resistance ； Thermal Conductivity

參考文獻

[2] 賴美錵，「擴散熱阻於電子構裝之分析與應用」，碩士論文，元智大學機械工程研究所，2000。

[4] M. Grujicic, C. L. Zhao, E. C. Dusel, “The Effect of Thermal Contact Resistance on Heat Management in the Electronic Packaging”, Applied Surface Science, 2005.

[5] Dr. Ron Hunadi, “Thermal Greases with Exceptionally High Thermal Conductivity and Low Thermal Resistance”, International Symposium on Advanced Packaging Materials, 1998.

[6] Wui-wai Cheng, Chakravarti Madhusudana, “Effect of Electroplating on the Thermal Conductance of Fin-Tube Interface”, Applied Thermal Engineering, 2006.

[8] J.P. Gwinn, R.L. Webb, “Performance and Testing of Thermal Interface Materials”, Microelectronics Journal, 2003.