代理商整合電子業上下游技術轉移策略研究-以系統級封裝技術轉移為例

AGENT TECHNOLOGY TRANSFER STRATEGY ON SUPPLY CHAIN INTEGRATION：A CASE OF SYSTEM-IN-PACKAGE (SiP) TECHNOLOGY

沈基盟(Chi-Meng Shen)

指導教授 ： 何建德教授

元智大學/管理學院/管理研究所/碩士(2007年)

https://doi.org/10.6838/YZU.2007.00145

摘要

伴隨著消費者對通訊產品的需求大幅提昇與產業競爭擴張，產品推陳出新的速度已儼然成為企業優勝劣敗的關鍵要素。在精密及量產的基本條件下，設備及製程技術選擇正確與否對製程品質與生產效能具有決定性的影響能力，使得設備及製程技術的評估成為製程規劃中重要的一環。
在台灣電子產業興起之初期，由於國內製造技術及市場規模有限，設備及製程技術之導入多為國外的製造商(以下通稱原廠)透過授權機制將銷售控制權賦予代理商委託出售。在近幾年來的努力下，台灣已儼然成為電子產品的研發重鎮。但在對岸勞工便宜及眾多政府優惠下，台灣的電子產業業者面臨來自對岸的競爭日漸升高；又在電子消費品的市場規模大幅成長之下，節省成本、增加產能、提高良率已是許多電子業業者在電子消費品市場追求利潤的首要條件之ㄧ。在節省成本、增加產能、提高良率的普遍要求下，提供新技術或製程的改良已是現在代理商在面對客戶時的挑戰。代理商如無法提供新技術或製程的改良給客戶時極可能代理市場業務之營運面臨挑戰：代理商品銷售失利，即面臨代理權轉換之危機。然而當代理商品行銷獲利，卻又無可避免原廠接手實行直銷的潛在風險。有鑑於此，同步發展自有技術、或藉原廠技術合作，將具有量產性暨市場主流性之代理技術移轉，成為代理業者永續經營之不二法門。
綜觀近期電子產業的動態，半導體被比喻為「產業之米」可見得半導體是台灣電子產業中的根本。而SMT產業是讓將「產業之米」能開花結果的最大功臣。回顧兩者的發展足跡，不難發現兩者是相輔相成的。然而在技術轉移的合作層面上，雖是時有所聞，但大多僅侷限於半導體產業將技術轉移給下游SMT產業，鮮少聽聞SMT產業將技術轉移給上游半導體產業。因半導體產業相較於SMT產業其產值較高且半導體產業要求高良率。因此相對於良率提升會比增加產能的技術來的關心。但因市場競爭不斷擴大，使得半導體產業也開始尋求產能提升的方案。因此，如何透過技術移轉取得技術能力以符合趨勢需求，成為設備代理商所需直接面對的重要議題。
然而，若技術移轉績效不彰，不僅只無法使設備供應商取得所需技術，更可能因為投入移轉所致時機延誤，使技術研發延遲，錯失商機。有鑑於此，本研究將以系統級封裝(System-in-Package，SiP)技術轉移為例，來論述代理商整合電子業上下游(半導體封裝、SMT)技術轉移策略研究。探討設備代理商在面對客戶及原廠時所採取之技術移轉的技術門檻、轉移觀念與成本、轉移的過程及代理商所扮演的角色等系統概念。

關鍵字

技術 ； 技術移轉 ； 技術移轉模式 ； 技術移轉績效 ； 組織行為 ； 代理商 ； 原廠 ； 通路權力 ； 關鍵零組件 ； 產業分析 ； 五力分析 ； 國家競爭優勢 ； SiP關鍵製程 ； 文化差異 ； 溝通策略 ； 技術移轉契約 ； 關鍵成功因素

並列摘要

Due to the raise of needs in consumer communication products and intensive rivalry in the electronic industry, the speed of product renewal in the market is a key to success. While accuracy and easy production is fundamental to the industry, the capability to select good equipment and right process technologies is an important part to manufacturing planning.
In the beginning of electrics industry in Taiwan, due to limited market and production technology, equipment and production technologies relied on foreign vendors or their agents. Now, Although Taiwan has become a global electric industry base, China, with the advantage of cheap labor and production factors, becomes main competitor to Taiwan. As production technologies for communication products advance, lowing cost, increasing yield, and raise output value are challenge for electric industry. If an equipment agent cannot offer new process or improve old process, the agent possibly encounters challenges from customer, competitor or its partner vendor. Base on these reasons, an equipment agent must develops own technology or cooperate with the vender to transfer technology to end user. It is agent’s core value added to the equipment sales and services process..
Semiconductor is the basic of electric industry. Semiconductor to the electronic industry is as food to human. Among the technologies, Surface Mount Technology (SMT) is the one that make the industry flourish. Reviewing the developing paths of SMT and semiconductor technologies, it is found that the two are complimentary to each other. However, technological interchanges between the these two fields have been less reported. Few cases were technology transfer from semiconductor industry to SMT industry but transfer from the reverse direction is not found yet.
Because the semiconductor industry has relatively higher output value than the SMT industry, semiconductor industry demands for higher yield rate. Additionally, increasing production capacity is another issue for the semiconductor industry owing to the expanding range of competition in the electronic industry. As a result, technology transfer for the above purposes is the task for equipment agents.
On the other hand, if equipment agents fail to conduct successful technology transfers, not only the equipment suppliers can not obtain necessary technologies but also losing market opportunities. For all these reasons, this research studies the technology transfer at system level of semiconductor packaging and uses the System-in-Package (SiP) technololgy as a case. It aims to explore the equipment agent’s strategy on integrating semiconductor packaging and SMT technologies. Technological barriers, costs and process of the transfer process are discussed from the equipment agent’s standpoint and reported in this thesis.

並列關鍵字

Technology Transfer ； Equipment agent ； Semiconductor Packaging ； Surface Mount Technology (SMT) ； System-in-Package (SiP)

參考文獻

余序江/許志義/陳澤義，(1998)，「科技管理導論：科技預測與規劃」，台北，五南出版社。

牟利凡，(1990)，「台灣電子產業進口代理商面臨原廠轉換之因應策略」，私立元智大學管理研究所未出版碩士論文；許士軍教授指導。

林明池，(2000)，「利用覆晶構裝技術開發靜態隨機存取記憶體(SRAM)之多晶片模組(MCM) 」。元智大學 化學工程研究所碩士論文。

Course Material from Franklin Pierce Law Center--Licensing Intellectual Property / Technology Transfer & Intellectual Property Management

Frazier and John O. Summers (1984), "Interfirm Influence Strategies and Their Application within Distribution Channels," Journal of Marketing, 48 (Summer), pp. 43 - 55