熱壓合製程參數對無鹵素產品可靠度之影響研究

The Influence of Lamination Parameters on the Reliability of Halogen-free IC Carriers

宋健民(Chien-Ming Sung)

指導教授 ： 林育才

元智大學/工程學院/機械工程學系/碩士(2009年)

摘要

本論文主要探討多層無鹵素IC載板的壓合製程參數為主，使用德國博可熱壓機作為此次測試使用機臺，搭配熱電偶做實際料溫的監控。利用不同的熱壓合程式設定，來控制升溫速率、上壓溫度及Curing時間三個主要參數。
利用不同條件壓合後的半成品，需先測試抗拉強度以確認壓合後銅箔與膠片的結合力是否足夠，並使用錫爐測試及切片做產品初步的可靠度確認。最後待成品完成後，還需經過迴焊測試，以模擬實際封裝時可能面對的考驗。經由以上的測試後，發現Curing時間不足會造成拉力不佳，而增加Curing時間對可靠度並未造成任何顯影響。同時將升溫速度減慢並降低上壓溫度，對錫爐與迴焊測試的次數有提升的作用。反之拉高升溫速率與提高上壓溫度，則會使錫爐與迴焊測試的次數降低。後續此一類型的膠片可使依循此原則，作為壓合程式設定的基準。

關鍵字

無鹵素 ； IC載板 ； 熱壓合

並列摘要

The research investigates the effects of lamination parameters for multi-layer Halogen-free IC carriers on product reliability. The hot press machine is from Burkle, Germany, which is equipped with thermocouples to monitor the product temperature. Three major parameters studied in this thesis includes, the heating rate, press starting temperature, and curing time by using different settings of a lamination program.
The products after the lamination process are first examined by the peel strength and solder dip tests to meet the quality requirement and then the reflow test is applied to examine the reliability. The results show that the peel strength reduces when the curing time is not long enough, but with a longer curing time the strength does not improve further. It is also shown that the lamination process will need more test cycles in solder dip and reflow processes when both the heating rate and press starting temperature decrease, but it needs less test cycles in solder dip and reflow when both parameters increase. It is hoped that the obtained results can become criteria for the same type of lamination process.

並列關鍵字

Halogen-free ； IC carrier ； lamination

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