模組封裝業之現況分析及因應對策:以T公司為例

Status and Trend Analysis of the Packaging Industry and the Solutions: A Case Study of the T Company

林暉焜(Hui-Kun Lin)

指導教授 ： 陳家祥

元智大學/管理學院/管理研究所/碩士(2008年)

https://doi.org/10.6838/YZU.2008.00235

摘要

隨著電子科技的快速發展，從摩爾定律（Moore’s law）來預測積體電路大約每18~24個月，就會提高積集度一倍，迫使半導體元件的特徵尺寸日趨縮小，模組封裝技術也跟著日新月異。
本論文對半導體產業做概略介紹，再針對目前的模組封裝產業做現況以及產業的未來發展趨勢分析。以國內上市之同欣電子工業股份有限公司做為研究對象，藉以探討及分析模組封裝業的內、外競爭環境，歸納出個案公司營運現況以及相關因應對策。希望能對有心探討此議題的人，有所參考幫助。
封裝業者所遇到的難題，除了要面對外部競爭之外，利潤的降低和新產品的開發速度更是急待解決的課題。產品生命週期快速縮短的市場環境下，要如何能快速反應客戶需求，掌握客戶，降低成本，建立核心技術，並從差異化中找出企業目標。

關鍵字

積體電路封裝 ； 高頻通訊模組 ； 陶瓷基板電鍍

並列摘要

With the rapid technical advance, Moore's Law, the guiding principle that has driven the digital revolution, predicts that the integrated density of integrated circuits will be doubled every 18-24 months. The high integrated density facilitates the downsizing of circuit components as well as packaging technologies.
A research is conducted to evaluate the current packaging industry and the packaging trends in future development. In addition to the problems with competitors, the cost reduction and new product development are two major challenges for the packaging industry. To shorten the product cycle times, it is important for companies to find ways to fast react to customers’ needs, reduce costs, and establish the core technology, and finally establish the business goal by differentiating the key competence from others.
With the listed company, Tong Hsing Electronic Industries, as the research target, the aim of this study is to provide a thorough investigation on the internal and external environment including competitors analysis, the existing business operations of the case company, and provide solutions for ensuring competitive advantage. Implications for theory and practice are offered.

並列關鍵字

Integrated Circuits Package ； RF Module ； Direct Copper Plating(DPC)

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