微小型體聲波元件之設計與製造

Design and Fabrication of Miniaturized Film Bulk Acoustic Devices

林宗賢(Chung-Hsien Lin)

指導教授 ： 方維倫

國立清華大學/工學院/動力機械工程學系/博士(2006年)

摘要

體聲波元件同時具備低損耗、可承受高功率、且容易與積體電路整合之特點，在高頻通訊系統上為一個相當重要的元件。本論文分析薄膜型體聲波元件之需求規格，並於目前商用軟體ADS 中建立不同材料聲波傳導之模型，進而設計微機電體聲波共振器。同時也建立了一個背向晶片乾蝕刻的微加工製程，完成體聲波共振器的製造。本文也利用了高頻測試的方式，驗證了共振器設計結果，測得共振器的品質因子大於 1000。在應用方面，本研究設計並製造了不同頻段的高頻濾波器，同時驗證了微小型的封裝。最後，本研究也嘗試了體聲波元件的整合，包括整合被動元件以製造體聲波雙工器，與整合 Bi-CMOS MEMS 可變電容來達到體聲波元件微調共振頻率之功能。本論文除了改善現有微機電體聲波元件製程與封裝方法外，更利用這些結果驗證了本文所提的設計平台。此一系統化的設計平台與設計流程未來可以作為完成薄膜型體聲波元件的重要基礎。

關鍵字

微機電 ； 體聲波 ； 薄膜型體聲波元件 ； 射頻

並列摘要

Bulk Film bulk acoustic devices have the advantages of low loss, high power duriability, and high compatibility with integrated circuits. This study will improve the performance of the bulk acoustic devices using MEMS technology, moreover, this study also analyzes the requirement of film bulk acoustic devices and build acoustic models in commercial microwave software ADS. Resonators are designed by this model to meet required specifications. This study has developed a dry etching process to fabricate the resonator. The measured quality factor of this resonator is over 1000. Filters and its miniaturized packaging method are studied and verified. Moreover, this research also investigates on integration of bulk acoustic resonators with passive elements, such as inductors, capacitors, and Bi-CMOS MEMS varactors. In summary, this thesis not only improves the fabrication and packaging process of FBAR devices, but also provides a verified design plateform. This developed model and systematic design methodlogy are the foundation for future bulk acoustic devices.

並列關鍵字

MEMS ； Bulk Acoustic Wave ； FBAR ； RF

參考文獻

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