創新半導體製程研發平台經營策略之探討-以個案公司發展策略規劃為例

The Business Strategy of Innovative Semiconductor Process Development Platform - Strategy Plan of the Case Company

王寅財(Wang, Crain)

指導教授 ： 林博文

國立清華大學/科技管理學院/高階主管經營管理碩士在職專班/碩士(2009年)

摘要

我國在2002 年提出的“Two Trillion and Twin Star”計畫，並以半導體產業及 光電顯示類為主要產業，兩者的產值皆達到約新台幣一兆元。 台灣的半導體相關廠商在全球的半導體產業中一直有相當優異的表現，台 積電(TSMC)和聯電(UMC)分別名列全球晶圓代工製造業的第一、二名，引領著 台灣半導體供應鍊的繁榮發展。台灣半導體產業可謂密集且完整，包含從上游 的IC 設計廠商到下游的封裝廠及測試廠。 近來的金融風暴對台灣半導體產業造成了相當嚴重的衝擊和影響，代工製 造廠商創下有史以來最低的產能利用率，而四家主要的DRAM 製造商共計破紀 錄的年損失(2008)超過新台幣一千一百二十五億元。台灣DRAM 業者所面臨最 大的一個挑戰是，在台灣沒有自主的研究和製程發展的根基。 然而，半導體R&D 研究支出與日俱增，其支出年成長已遠超過了IC 銷售 額的年成長率，依據新的IC insight 報導指出，在1990 到2007 年間，R&D 和工 程支出額的年均複合增長率(Compound Average Growth Rate, CAGR)為百分之十二 點七(12.7％)，而在這十七年間，半導體銷售的年居複合增長率僅為百分之九點 九(9.9％)。下一世代的製程發展費用預計約超過二到三十億美元，這項支出對 多數的IC 製造廠商便成一項沉重的負擔，因此，研發聯盟(R&D consortium)已成 本論文中將探討藉由研發委外(R&D outsourcing)以降低半導體製造業者成本 的可能性，介紹高效能組合式研發平台(High Productivity Combinatorial, HPC)，並 說明其對於IC 產業研發所提供的功能和效益。此外，藉由個案討論，探討個案 公司商業發展模式和策略，探究個案公司對於新市場所來的服務和影響。

關鍵字

半導體 ； 晶圓代工 ； 動態隨機存取記憶體 ； 高效能組合式研發平台

並列摘要

The project “Two Trillion and Twin Star” launched in 2002 chose Semiconductor
and Display as the key component industries whose output value both hit NTD one
Taiwan’s enterprises have a great performance in the global semiconductor
industry. TSMC and UMC, respectively ranking 1st and 2nd on the IC manufacturing
around the global, lead the prosperity of the semiconductor supply chain development
in Taiwan. Taiwan’s semiconductor Industry has distinguished itself by its complete
industry clusters to incorporate from IC design manufacturing to packaging and test
With the recent economic crisis, Taiwan’s semiconductor industry also
encounters the most serious challenges. Foundry manufacturing companies hit the
record low utilization, and also the record high annual loss to NTD 112.5 billions as
One of the biggest challenges to Taiwan DRAM industry is that we do not have
fundamental research and development seeded in Taiwan. However, semiconductor
R&D engineering costs are rising at the faster rate than IC sales. According to a new
report from IC insights, R&D and engineering expenditures increased at a compound
average growth rate (CAGR) of 12.7％ between 1990 and 2007, while semiconductor
sales grew at a CAGR of 9.9％ in the 17 years period.
The next generation’s device development costs over US$2-3 billions and
becomes not affordable for most of IC manufacturer players. R&D consortium
becomes main stream for today’s semiconductor process development. In this thesis,
we evaluate the possible ways for semiconductor IC manufacturers to lower their cost
by R&D outsourcing; and introduce the revolutionary High Productivity
Combinatorial (HPC™) Technology, and discuss how it works to redefine the IC
industry R&D. We also use a case company as a study pointing to exam its business
model and product development and sales strategy.

並列關鍵字

Semiconductor ； Foundry ； DRAM ； High Productivity Combinationa(HPC™) Technology

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