於本論文中,將於圖形化藍寶石基板(PSS)上利用有機金屬化學沉積法(MOCVD)所成長的p-i-n二極體晶圓,利用嚴謹的製程技術製作並研究高功率氮化鎵(Gallium Nitride ; GaN) p-i-n二極體的元件電特性。當操作於逆向偏壓下,由於高功率氮化鎵p-i-n二極體元件須具有高崩潰電壓的能力,因此必須仰賴良好的缺陷抑制能力;同時,於順向偏壓操作下,此元件追求更低的功率消耗,故須具備相當低的串聯電阻。 於本論文中,高功率氮化鎵p-i-n二極體的元件利用二階段的平台結構的設計抑制元件邊緣效應,包含製程所造成的缺陷影響及逆向電場於元件平台的影響等,進而獲得良好的逆向崩潰特性。在發現適當的元件結構後,以此結構製作並研究在i層具有極低載子濃度的氮化鎵p-i-n二極體元件。最後,利用二階段的平台結構的設計結合適當的平台邊緣處理技術,在具有極低i層載子濃度的磊晶結構下,得到接近800 V的逆向崩潰電壓以及其巴利加優值(Baliga’s Figure of Merit, BFOM)接近碳化矽(SiC)極限效能的優良結果。
In this study, the Gallium Nitride (GaN) p-i-n diodes grown on pattern sapphire substrates by MOCVD have been fabricated to study the electrical characteristics of the GaN p-i-n diodes. To be a great high power device, the reverse breakdown characteristics of GaN p-i-n diodes are dominated by the capabilities of defect suppression at reverse bias; at the same time, the forward series resistances of GaN p-i-n diodes must be reduced for low power dissipation at forward bias. In this study, firstly, the edge termination effects of the GaN p-i-n diodes including the damages resulted from ICP etching and electric field distribution were inhibited by using two-step mesa structure and suitable process parameters, and these fabricated devices exhibited great performances. After the suitable process flow has been confirmed, the GaN p-i-n diodes with ultra-low i- layer concentration have been fabricated. Finally, the results of the devices with ultra-low i- layer concentration and two-step mesa structures show the high BFOM values and the high breakdown voltage values, respectively. The device with the highest BFOM is very close to the dash line for SiC-limit. The fabricated devices with suitable process parameters and low i- layer concentrations are greater than the previous reports of the GaN p-i-n diodes grown on sapphire substrates.