藍寶石晶圓品質改善探討

Quality Improvement of Sapphire Wafer

鄭松森

指導教授 ： 黃雪玲

國立清華大學/工學院/工業工程與工程管理學系工程碩士在職專班/碩士(2009年)

摘要

由於LED市場的蓬勃發展及終端需求變化快速和多樣性以及各大藍寶石基板材料供應廠商間的激烈競爭，藍寶石晶片之品質及客製化之晶片已成為顧客滿意度提升的重要基本條件，企業的生產力、競爭力決定於產品之品質、成本、交期，在追求實現品質的改善過程中，往往會碰到許多產品設計或生產製造上的技術問題或瓶頸，皆是工廠良率無法提升的重要因素之一，藍寶石之品質令顧客滿意時，便有令人滿意的績效，也會提高顧客忠誠度，並改善市場佔有率。
本研究以A公司為一個實際之例子，根據特性要因分析，得知藍寶石研磨製程破片及晶片刮傷之發生原因，主要在人員之作業手法、人員從業態度管理、班別輪替間之交接及機台壓力控制方面，在人員部份針對各項列出之要因探討發生之根源並對於人員管理上預防溝通失誤及交接異常之產生，透過有效的人員管理、工作改善、設施規劃及品質手法來改善人為失誤的發生及產品製程上的品質問題，進而提升良率與降低成本。
本研究針對各項主要因素進行改善後可將研磨之破片率及刮傷率有效的降低，機台自動化之改裝後，除改善破片率之外並可改善人員因為忘記時間及壓力之調整而造成晶片厚度超出規格之情事，減少晶片無謂之損失。並經由結果的討論得知提出本研究的貢獻、及未來發展方向。

關鍵字

藍寶石基板 ； 人因工程 ； 設施佈置 ； 自動化

並列摘要

Due to bursting development of LED market, highly change and various of requirements, and competition among all sapphire supplier, quality of sapphire and wafer-customization have become fundamental conditions of raising customer satisfaction. Productivity and competitiveness of an enterprise is determined by quality, cost, delivery time of product. During the period of quality improvement, the company may encounter technical problems or bottleneck from manufacturing and product design which all are important factors of causing yield loss.
This research took company A as an example. According to cause-effect analysis, the reasons of causing wafer broken and wafer scratch during grind process were operating method of people, attitude management toward job, job transfer between duty-shift and pressure control of equipments. The research not only discussed the root causes of cause-effect generating from people, but also prevents from miscommunication, and job transfer anomaly. To assess one’s proficiency was also one of the management methods mentioned. Through effective human management, job improvement, facility plan and quality control methodology, improvements of decreasing man-made error, and process quality were available, the high yield and low cost can also be acquired.
The research predicted that wafer broken and scratch can be decreased through improving factors above. After automatize equipments, one can decreased wafer broken rate, parameters, such as time and pressure, setting error that resulted in wafer thickness out of spec and wafer loss. Through the discussion of results, we could put forward the contribution, limitation and future development.

並列關鍵字

Sapphire Substrate ； Human Factors ； Automation ； Facility Layout

參考文獻

16. 戴瑞德(2001)-晶圓製造廠系統化設施規劃，中原大學工業工程研究所碩士論文

7. 吳信宏(1999)-全面品質管理之探討，品質管制月刊，第44-46頁。

10. 黃雅君(2006)-探討作業人員特質與其人力資源管理之認知對作業缺失之關聯性分析，國立成功大學工業與資訊管理學系專班碩士論文

13. 勞工安全衛生研究所(2000)-輪班生活知多少？對健康等影響(89/7/7)

14. 劉鴻世(2007)-製造環境中人為失誤損失推估模式之研究，國立清華大學工業工程與工程管理學系博士論文