由於光電顯示產業如液晶顯示器、軟性顯示器的快速發展,越來越多種透明材質的基板及表面薄膜結構逐漸被開發使用。而在商品化的過程中,必須面對品質檢測的需求;因此如何量測透明物件的形貌尺寸,愈發重要。 本研究探討應用差分干涉對比(Differential Interference Contrast, DIC)顯微技術於三維形貌量測的可行性。差分干涉對比(DIC)顯微技術原為一影像強化技術;慣用於強化透明物件與背景之差異。但檢視其原理,應可用於透明物件的三維形貌的量測上。原本用於影像強化時,利用積分將差分相位還原時,計算精確度的要求並不高。但用於三維形貌量測時,如何降低雜訊對積分的影響便變得非常重要。在本研究針對定量化的還原相位演算法,提出修正型傅立葉相位積分(Modified Fourier Phase Integration, MFPI)重建演算法可以有效的降低雜訊的影響。 另外架設硬體量測實驗,驗證所提出的重建法應用於實際量測中。並研究不同光路型式的差分干涉對比術(DIC):反射式與穿透式量測的情形與差異,建構出能夠量測透明材質待測物表面三維形貌的量測平台。
Through the development of Opto-electronic industry such as liquid crystal display, flexible display expand very fast, lots of substrate and thin film are made by transparent material. In the process to become consumer products, there is an essential issue of inspection for the quality control, so how to measure the topography and geometric size of transparent object become more and more important. In this paper, we discuss and verify the three-dimensional topography measurement by Differential Interference Contrast(DIC) microscopy. Differential Interference Contrast(DIC) microscopy was an image processing method that was usually used to enhance the contrast between transparent specimens and background. According to its principle, it may be also apply to three-dimensional topography measurement of transparent objects. But as a profile measurement technique, it is important in the integration process, so we propose a quantitative phase restoration method, called Modified Fourier Phase Integration(MFPI), that depress the image noise effect. Next, we set an experiment to validate the integration method in reality and research the different optical path type: reflected and transmitted DIC. Finally, we construct a three-dimensional topography measurement equipment of transparent object.