探討待測物表面形貌對於差分干涉對比術量測的影響

The Effects of Surface Geometry on Differential Interference Contrast Measurement

陳偉倫(Wei-Lun Chen)

指導教授 ： 林士傑

國立清華大學/工學院/動力機械工程學系/碩士(2011年)

摘要

由於光電顯示產業的快速發展，越來越多透明材質的基板及薄膜被開發使用。此外，為了朝向輕薄化的趨勢發展，並且兼顧良好的成像品質，許多複雜的微結構被設計、應用在透明材料上，如ITO(Indium Tin Oxide)導電玻璃和塑膠等。而在商品化的過程中，必須面對品質檢測的需求，因此如何量測透明物件的形貌尺寸就顯得相當重要。
在先前的研究中，已經驗證了差分干涉對比顯微術(Differential Interference Contrast Microscopy, 以下簡稱：DIC顯微術)用於定量化重建透明材質高度的可行性，然而，對於表面形貌變化較複雜的待測物並沒有相關的深入研究。本研究將探討以DIC顯微術量測透明材質三維形貌時，試片傾斜表面對於重建結果的影響。
研究初期，使用光學模擬軟體ASAP建立DIC顯微鏡的架構，協助釐清各項光學參數對於DIC顯微影像的影響，並且模擬理想狀況下的DIC顯微影像。接著建立一套DIC檢測平台，針對表面形貌為傾斜表面的透明材質待測物進行外觀形貌的重建，以探討DIC顯微術用於透明材質傾斜表面形貌量測的可行性。

關鍵字

差分干涉對比術 ； 表面形貌量測 ； 定量化重建

並列摘要

Transparent components such as thin-film transistors, glass substrates, and light guide plate are greatly employed due to the rapid development of optoelectronic industry. More and more transparent components with complex geometries are used to fulfill the need. Therefore, there is an increasing demand for measuring the profile of these transparent components.
In the previous study, we adopted the differential interference contrast (DIC) technique to measure the sub-micron thickness of transparent objects with step high structure. It is of interest to further study the light propagation mechanisms in the transmitted DIC system when transparent component with complex geometry is measured.
In this study, the wedge angle measurement of prisms is used as a stepping stone to study the effects of complex geometry on the DIC images and profilometery reconstruction results. The study might provide some valuable information for adopting the DIC technique to measure the profile of transparent objects with complex geometry.

並列關鍵字

Differential Interference Contrast (DIC) ； topography

參考文獻

[19] 余昇剛, “應用差分干涉對比術於透明材質的三維形貌量測方法”,清華大學碩士論文 (2009)

[2] G. Agranov, V. Berezin, and R. H. Tsai, “Crosstalk and Microlens Study in a Color CMOS Image Sensor”, IEEE Trans. Electron Devices, vol.50, no.1, pp. 4–11, (2003)

[4] Ruey Fang Shyu, Hsiharng Yang, “A Promising Thermal Pressing Used in Fabricating Microlens Array”, Int J Adv Manuf Technol, 36:53–59, (2008)

[5] Xiangliang Jin, Xiaoping Fan, Zhibi Liu, Zhangqu Kuang, Jie Cheng, Jie Chen, Yu Liu, and Jun Yang, “Measurement of High Sensitivity and Low Crosstalk of Zero-Space Microlens for 2.8-μm-Pitch Active Pixel Sensor”, IEEE Trans. Electron Devices, vol. 57, (2010)

[6] Ray-Quen Hsu, Hsing-Bun Wang, and Da-Lan Liang, “Hot Embossing of Parallel v-Groove Microstructures on Glass”, J. Am. Ceram. Soc., pp. 2605–2608 (2009)