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  • 學位論文

創新能力累積模型研究 : 以積體電路基板公司為例

A Model of Innovation Capability Accumulation :The Case of Integrated Circuit Substrate Company

指導教授 : 張元杰
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摘要


本研究以積體電路基板(IC substrate)個案為例,探討產品開發流程中資源管理之挑戰,研究如何運用有限的研發資源,在積體電路基板變化快速的產品生命週期中,擬定正確的研發策略以確保未來的競爭優勢。本研究發展了創新能力累積模型包括產品策略、技術策略、組織能力及技術來源,同時藉由欣興電子的個案分析,創新能力累積模型透過三個產品及兩個時段的實證驗證,研究結論顯示創新能力、產品策略及技術策略需於不同的時間點依市場需求及競爭態勢共同演化,企業才能建立持續的競爭優勢及永續經營。

並列摘要


This thesis examines innovation capability accumulation in the integrated circuit (IC) substrate company. The research develops an innovation capability accumulation model that consists of product strategy 、technology strategy 、 organizational capability and technology sourcing. Via a case study of Unimicron Technology Corporation,the model illustrates innovation capability accumulation along with three product development and two dynamic period of time. It concludes that it co-evolves between innovation capability、product strategy 、technology strategy and sourcing strategy in order to sustain company’s competition advantage.

參考文獻


#呂淑宜,2005,TFT-LCD產業新產品開發流程之研究 清大工工碩士論文。
#Abernathy, William J. & Utterback, James M , 1978 , Patterns of Industrial Innovation, Technology Review MIT Alumni Association.
#Burgelman, R. , Maidique, M. A. & Wheelright, S.C. , 2004 , Strategic Management of Technology and Innovation (pp. 8-12), New York: McGraw-Hill, 8-12.
#Cooper, R.G. & Kleinschmidt, E.J. , 1997 , Winning businesses in product development : The critical success factors, Journal of Product Innovation Management, 14(2), 132-132.
#Howells, Jeremy , 2006 , Research and Technology Outsourcing, Economic and Social Research Council (ESRC) through the activities of Research on Innovation and Competition (CRIC), Universities of Manchester/IJMIST.

被引用紀錄


權大衛(2011)。先進製程技術之投資效益評估-以多模光纖預型體為例〔碩士論文,國立清華大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0016-1908201112575933

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