運用價值工程提升新產品競爭力之探討：以無線通訊SiP產品為例

Apply Value Engineering to Enhance New Product Competitiveness:A Case Study of Wireless SiP Products

黃麗茹(Li-Ju Huang)

指導教授 ： 邱銘傳

國立清華大學/工學院/工業工程與工程管理學系/碩士(2014年)

摘要

台灣半導體企業在面臨韓國、大陸和東南亞地區競爭者的威脅下，新產品開發時面臨創新研發、產品品質及生產成本等多方的嚴峻考驗，若缺乏有效的規劃恐造成產品生命週期(Product Life Cycle, PLC)提早進入成熟期或衰退期，產品將面臨殺價競爭、甚至被其他新產品所取代的威脅；若能提早在新產品開發階段，即將產品功能、品質議題、生產模式與成本控制等問題納入考量，找到產品切入市場的最佳解決方案，則將可以大幅提升產品與企業的競爭力。
本研究以無線通訊產業中具競爭優勢與發展潛力的系統級封裝(System in Package, SiP)產品為例，探討案例公司如何以自身有限的資源及技術來開發新產品。運用價值工程(Value Engineer, VE)區分組成產品的重要零組件屬於主要功能或次要功能，藉由深度訪談法(In-Depth Interview Survey)的專家意見針對主要功能或次要功能的成本和品質問題進行評估並給予權重，並以層級分析法(Analytical Hierarchical Process, AHP)將封裝、測試、以及重要零組件為根本目標評選出相關屬性，找出新產品開發的最佳方案。
本研究結果顯示，無線通訊SiP產品透過此方法可以有效簡化生產流程、提升製程穩定性及生產良率，並分別降低各階段成本為：主要功能5%、次要功能15%、封裝製程8.5% 及測試流程33%；本研究成果將延伸應用到新產品開發的前期審查階段，可以更準確地掌握新產品的開發效益，藉以提升新產品競爭力，並做為新產品開發決策者及設計者之參考方向。

關鍵字

系統級封裝 ； 產品生命週期 ； 價值工程 ； 深度訪談法 ； 層級分析法

並列摘要

Semiconductor companies in Taiwan confront the rigorous competition of competitors from South Korea, Mainland China and Southeast Asia, they constantly faced severe challenges on innovative research capability, product quality improvement and production cost down in terms of new product development. New products have to survive in the price competition and replacement of other new products. Product Life Cycle (PLC) might early fall into maturity stage or decline stage if it lacked effective planning. Therefore, the purpose of this research is to significantly enhance the competitiveness of products and companies in new product development if the relevant product features, quality issues, production patterns and overall cost control could be early considered to figure out the best solution before market intorduction.
This research investigates how a company under limited resources and technology capability can develop new products with a ase study on SiP product development in wireless communications industry. We firstly identify main features or minor features of key components in SiP product by Value Engineer (VE). Then, we conduct an in-depth interview and adopt the advice of experts to evaluate the cost and quality issues of key components and give weights to all of key components with Analytical Hierarchical Process (AHP). Finally, we propose an optimum solution in SiP new product development and which could effectively streamline production processes, improve process stability and production yield to achieve a cost reduction of 5% to main features, 15% to minor features, 8.5% in packaging process, and 33% in testing process. This research would be applied to review new product to enhance the competitiveness and accurately grasp the benefit of new product before mass production. It could be a reference guideline for decision makers and designers as a decision support system.

並列關鍵字

System in Package (SiP) ； Product Life Cycle (PLC) ； Value Engineer (VE) ； In-Depth Interview ； Analytic Hierarchy Process (AHP)

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