自建產能或委外：晶圓代工廠建立測試產能的抉擇

In-house or Out-source: Foundry Choice for Testing Capacity Establishment

黃凱亭

指導教授 ： 洪世章

國立清華大學/科技管理學院/經營管理碩士在職專班/碩士(2014年)

https://doi.org/10.6843/NTHU.2014.00466

摘要

半導體產業的生產模式最早期是由 IDM 廠一手包辦設計、製造的垂直整合，在1980年代晶圓代工以及封裝測試的廠商出現以後，漸漸的走向垂直分工的模式，也因此孕育出許多成功的 Fabless Design House。典型的合作模式是晶片商提供設計圖，由晶圓代工廠 (如台積電、聯電) 製造晶片，再交由測試廠進行晶圓良率測試 (如京元、欣銓)，最後由封裝廠 (如日月光、矽品) 進行晶圓切割、晶粒封裝、與 IC 最終測試的程序。
近十年來，隨著製程越來越複雜以及晶片設計商對於品質的要求日益升高，晶圓代工廠不再只是扮演好晶圓製造的角色即可，擁有快速的晶片良率回饋 (Fast Yield Feedback) 以便在第一時間發現並解決問題，並以此提供客戶包含晶圓良率保證的 Turnkey 服務對於晶圓代工廠日益重要。在這樣的需求下，自建測試產能或是委外給專業測試廠變成是所有晶圓代工廠所需面臨的課題。
H君為晶圓代工大廠 A公司的測試部門生產規劃主管， B公司是他們的大客戶，其產品為各式手持式裝置中所使用的通訊晶片。A公司提供B公司的服務屬於為「統包」模式 (Turnkey Service)，即除了晶圓製造之外，還包含晶圓良率測試服務。
最近B公司最新產品，X晶片的製造流程開發已進入最後的階段，預計在一季後進入量產。這顆晶片即將使用在全球前三大手機商的主力產品上，需求十分龐大。對A公司的測試部門來講，X晶片使用的是最新種類的測試機台，部門內並沒有該產能，決定增購新機台或是委外成為產能規劃時首要解決的問題。
此外，該產品的測試時間為一般產品的兩至三倍以上，且B公司要求能在極短時間內大量出貨。對A的測試部門來講，這將是有史以來最大的新機台產能需求；再者，即使決定全數委外，目前的協力廠商也沒有足夠產能滿足此一需求。
本論文欲研究在在考量成本、品質、交期、與快速良率回饋的需求下， H 君要如何決定建立自有產能或是委外，達成 B 客戶與 A 公司雙贏的局面？

關鍵字

晶圓代工 ； 晶圓測試 ； 良率 ； 產能 ； 委外

並列摘要

In the early stage of semiconductor industry, the production model is Vertical Integration, IDM (Integrated Design & Manufacturing) company handle design and manufacturing process. The production model changed to vertical separation after Foundry and Assembly Manufacturer appeared in 1980, and many successful Fabless Design Houses also emerged at the same moment. The typical cooperating model is Design House designs IC layout, Foundry in charge of wafer manufacturing (ex., TSMC, UMC), wafer testing house in charge of yield test (ex., KYEC, Ardentec), and Assembly site in charge of wafer sawing, package, and final test processes (ex., ASE, SPIL).
In the last decade, the semiconductor production is more and more complicated, and the quality requirement from Design Houses is also increasing. Foundry cannot just play the role as a wafer manufacturer, provides the value-added Turnkey service which includes “Fast Yield Feedback” and “Producing Problem Solving” is also very important. Base on above circumstance, all Foundries should face a choice to build their own wafer testing line or outsource to Pure-play wafer testing house.
H is A Foundry’s production planning manager of wafer testing department, and B company is A’s key customer. B’s products are the communication chips used in Mobile Devices. A provide B turnkey service, that means besides wafer manufacturing, A also supports B to handle wafer yield testing.
Recently B’s new product, X chip is moving into last stage of manufacturing development, and it will be turned into mass production after a quarter. This chip will be used on the world Top 3 cell phone manufacturers’ major products, the demand is very strong. X chip use the newest model of test platform and A Foundry did not have it. So for A Foundry’s testing department, they need to decide to buy new test platform or outsource to subcontractors
By the way, the test time of X chip is twice to triple than other products, and B is also request A to have the capability to deliver huge quantity chips in a very short time. This will be the largest new platform requirement for A’s testing department. Furthermore, even A decides to outsource all wafers, currently there is no subcontractor can provide enough capacity to fulfill this project.
To consider the requirement of cost, quality, delivery, and fast yield feedback, how does H make decision to “build InHouse capacity” or “outsourcing to subcotractor”, then achieve the win-win for B & A self?

並列關鍵字

Foundry ； Wafer Testing ； Yield ； Capacity ； Outsourcing

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