本論文探討Sn-Cu-Fe三元系統在250oC下之相平衡與Sn-Cu/Co-Fe反應偶之界面反應。在Sn-Cu-Fe三元系統於250oC下之相平衡研究中,共決定出七個三相區、九個兩相區以及八個單相區。其中將新發現之熱力學三元穩定相命名為ω相,其組成約為Sn40Cu30Fe30。Sn含量範圍約為39.9-45.7at%,Cu含量範圍約為15.4-34.6at%,Fe含量範圍約為22.2-42.1at%。 ω相與FeSn2、Cu6Sn5、FeSn、Cu3Sn與αFe有平衡關係。 在Sn-Cu/Co-Fe的整體界面反應研究中,在250oC下,當銲料中的Cu含量小於0.8wt%時,界面處會生成CoSn3相,與Sn/Co界面反應相同。特別的一點,當基材從3wt%Fe添加至7wt%Fe時,界面處的CoSn3相會隨著Fe添加量增加而變厚,此趨勢與Sn及Sn-Ag銲料相反。當銲料中的Cu含量大於0.9wt%時,Cu6Sn5相會被誘發出來。當Cu含量為2.0-3.0wt%時, Cu6Sn5相會隨著Fe的添加量增加而變厚。
This thesis investigates the phase equilibria of Sn-Cu-Fe ternary system at 250℃ and the interfacial reaction in Sn-Cu/Co-Fe couples. In Sn-Cu-Fe phase equilibria study at 250oC, six three-phase, nine two-phase, and eight single-phase regions are determined experimentally. It is noted that the experiment found a new ternary stable phase, and it named ω phase. The composition of this phase is approximate Sn40Cu30Fe30. The range of Sn solubility is 39.9-45.7at%, The range of Cu solubility is 15.4-34.6at%, The range of Fe solubility is 22.2-42.1at%. The ω phase is balance with FeSn2、Cu6Sn5、FeSn、Cu3Sn and αFe. In Sn-Cu/Co-Fe liquid/solid interfacial reactions, when the Cu additions are 0.8wt% at 250oC, the primary intermetallics is CoSn3 phase, it is correspond with Sn/Co interfacial reactions. It is notable that when the Fe additions are 3wt% to 7wt%, the CoSn3 phase is thicker than before. On the contrary, the CoSn3 phase in Sn-Ag/Co-Fe system become thinner when Fe added. While the Cu additions are 0.9wt% at 250oC, the Cu6Sn5 phase is formed in the interface. Finally, As the Cu additions are 2wt% to 3wt% at 360oC, the Cu6Sn5 phase is thicker when Fe added.