錫-銻-鈷三元系統相平衡與錫-銻/鈷界面反應

Phase Equilibria of the Sn-Sb-Co Ternary System and Sn-Sb/Co Interfacial Reactions

李立芃(Li-Peng Li)

指導教授 ： 陳志吉

中原大學/工學院/化學工程研究所/碩士(2013年)

https://doi.org/10.6840/cycu201300609

摘要

Sn-Sb銲料為目前商用之高溫無鉛銲料，Co為相當有潛力之覆晶構裝擴散阻障層材料，Sn-Sb/Co為覆晶構裝可能遇到之銲點結構。本研究探討Sn-Sb/Co界面反應做為評估Co作為擴散阻障層材料之可行性參考，為探討Sn-Sb/Co反應路徑，本論文也以實驗方法決定Sn-Sb-Co三元系統之相平衡。
在Sn-Sb-Co三元系統於300℃下之相平衡研究中，共決定出個13單相區、21個兩相區與10個三相區。發現一個Sn-Sb-Co三元相，根據組成表示為Co27(Sn, Sb)73，標示為π相。CoSb3、CoSb2、CoSb相中Sn溶解度分別為6.4、15與9at%，Co3Sn2相中Sb溶解度為5at%，其他相均沒有明顯之第三元溶解度。
界面反應之研究中，Sn-5wt%Sb/Co與Sn-10wt.%Sb/Co之液/固界面反應，界面處生成CoSn2相，銲料中析出π相。固/固界面反應，界面處生成π相和CoSn3相。各溫度下，銲料中Sb含量越高，生成相厚度越薄。於業界常用之可靠度測試溫度150℃下，Sn-Sb/Co反應偶介金屬相生長速率較Sn-Sb/Ni反應偶慢。
由於Co與Sn-Sb銲料之反應速率較常用之擴散駔障層材料Ni慢，Co為一值得評估之覆晶構裝擴散阻障層材料。

關鍵字

覆晶構裝 ； 界面反應 ； 相平衡 ； Sn-Sb-Co

並列摘要

Sn-Sb based alloys are the most promising high temperature lead-free solders, and Co-based alloys are recently evaluated as potential materials as the diffusion barrier layer materials in under bump metallurgy of the flip chip packaging. Sn-Sb/Co contacts are important in high temperature solders/Co soldering joints. This thesis investigates the interfacial reactions in Sn-Sb/Co couples and the phase equilibria of the Sn-Sb-Co ternary system at 300℃.
In Sn-Sb-Co phase equilibria study at 300℃, 10 three-phase, 21 two-phase, and 13 single-phase regions are determined experimentally. A ternary phase, Co27(Sn, Sb)73 (π) is found. Sn solubility in the CoSb3, CoSb2 and CoSb phases are 6.4, 15, and 9at%, respectively. No noticeable ternary solubility is found in the other binary phases.
In Sn-5wt%Sb/Co and Sn-10wt%Sb/Co interfacial reactions at 300℃, the reaction phase formed at the interface is the CoSn2 phase, and that precipitates in the solders is the π phase. In Sn-Sb/Co aging tests at 120, 150, and 180℃, the reaction phases are the π and CoSn3 phases. The reaction phase thickness decreases with greater Sb additions. The reaction phase thickness in Sn-Sb/Co couples is lower than that in Sn-Sb/Ni.
Because Co has a lower reaction rate with Sn-Sb solders than Ni, Co is a potential diffusion barrier layer material in flip chip.

並列關鍵字

flip chip packaging ； interfacial reactions ； phase equilibria ； Sn-Sb-Co

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