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  • 學位論文

錫-銻-鎳三元系統相平衡與錫-銻-(鎳)/鎳界面反應

Phase Equilibria of the Sn-Sb-Ni Ternary System and Interfacial Reactions in Sn-Sb-(Ni)/Ni Couples

指導教授 : 陳志吉

摘要


Sn-Sb銲料為目前已被使用之高溫無鉛銲料,而Ni是已知材料中,與銲料反應性最差的金屬,常被使用做為元件之表面鍍層。本研究以Sn-Sb-Ni系統為主軸,探討其相平衡關係與界面反應。在Sn-Sb-Ni三元系統於270oC下之相平衡研究中,共決定出12個單相區、21個兩相區,以及10個三相區。其中發現一個三元相,根據組成可標示為Ni(Sn1-x, Sbx)3,x=0.52-0.76,其結構與CoSb3相同,皆為方鈷礦(skutterudite)化合物,是良好的熱電材料。Ni3Sn2與NiSb由於結構相同,會形成一連續相。根據本研究之結構鑑定結果,Ni3Sn與Ni3Sb於270oC下不會形成連續相,與文獻中之結果不同,且Sn於Ni3Sb中之最大溶解度高達14.9at.%以上,所佔比例可高於Sb。由於Sn-Sb-Ni三元合金是富有潛力之鋰離子電池負極材料,本研究亦探討Sn-Sb-Ni三元系統於800oC下之相平衡關係。其中有5個單相區、5個兩相區以及兩個三相區。沒有發現三元相,而Ni3Sn2與NiSb仍會形成連續相。 界面反應之研究整體看來,Sn-Sb/Ni與Sn/Ni界面反應結果類似。Sn-5wt.%Sb/Ni與Sn-10wt.%Sb/Ni之液/固反應生成Ni3(Sn, Sb)4相之活化能分別為23.0與27.6 kJ/mol;固/固反應生成Ni3(Sn, Sb)4相之活化能分別為52.0與52.8 kJ/mol。Sn-5wt.%Sb/Ni之反應速率高於Sn-10wt.%Sb/Ni。 有鑑於本研究中發現之三元相- Ni(Sn1-x, Sbx)3富有相當的應用價值,本研究以界面反應法,搭配所決定出之Sn-Sb-Ni三元相圖,合成此熱力學穩定之三元相。於Sn-Sb合金添加微量Ni,在270oC下與Ni基材反應,可成功合成Ni(Sn1-x, Sbx)3相。

關鍵字

界面反應 錫-銻-鎳 相平衡

並列摘要


Sn-Sb based alloys are the most promising high temperature Pb-free solders. Nickel is the widely used surface finish for electronic packaging. Sn-Sb/Ni is the frequently encountered contact in electronic products. This study investigates the phase equilibria of the Sn-Sb-Ni ternary system and the interfacial reactions in Sn-Sb-(Ni)/Ni couples.   The isothermal section of the Sn-Sb-Ni ternary system at 270oC is experimentally determined in this study. There are 10 three-phase, 21 two-phase, and 12 single-phase regions. A ternary compound, Ni(Sn1-x, Sbx)3, is found, where x=0.52-0.76. The Ni(Sn1-x, Sbx)3 phase is with the structure of the CoSb3 phase, which is a skutterudite compound. Ni3Sn2 and NiSb form a continuous phase. In the isothermal section of the Sn-Sb-Ni ternary system at 800oC, there are two three-phase, five two-phase, and five single-phase regions. Ni3Sn2 and NiSb also form a continuous phase.   The Sn-Sb/Ni interfacial reaction is similar to that of Sn/Ni. The main reaction phase is the Ni3(Sn, Sb)4 phase. For liquid/solid interfacial reactions, activation energies are 23.0 and 27.6 kJ/mole in Sn-5wt.%Sb/Ni and Sn-10wt.%Sb/Ni couples, respectively. For solid/solid interfacial reactions, activation energies are 52.0 and 52.8 kJ/mole in Sn-5wt.%Sb/Ni and Sn-10wt.%Sb/Ni couples, respectively. The reaction rate in the Sn-5wt%Sb/Ni couple is faster than that of the Sn-10wt%Sb/Ni. By adding small amount of Ni in the Sn-Sb solders, the ternary compound Ni(Sn1-x, Sbx)3 can be formed via the Sn-Sb-(Ni)/Ni interfacial reactions.

參考文獻


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被引用紀錄


梁沅鎧(2014)。無鉛銲料與鈷-鐵合金之界面反應及錫-鈷-鐵三元系統相平衡〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201400404
李立芃(2013)。錫-銻-鈷三元系統相平衡與錫-銻/鈷界面反應〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201300609
方谷(2013)。錫-鎳-矽三元系統相平衡與錫-(銅)/鎳-矽界面反應〔碩士論文,中原大學〕。華藝線上圖書館。https://doi.org/10.6840/CYCU.2013.00164

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