熱流板內加熱器溫度最佳化研究

Study on Optimal Thermal Distribution for Hot Runner Manifold Heater

林承洋(Chen-Yang Lin)

指導教授 ： 陳夏宗

中原大學/工學院/機械工程研究所/碩士(2009年)

https://doi.org/10.6840/cycu200901123

摘要

摘 要
本論文針對熱流板內加熱器對熱流道最近表層受熱的溫度分佈探討其可視化與可控性。過程依據實驗數據為基礎，進行CAE熱分析軟體模擬，建立熱源溫度場可視化技術，開發加熱器配件模組，尋求最佳化溫度控制模式。
首先確認實驗樣品品質，採用國際MIL-STD-105E抽驗規範。再行定時量測分段溫度分佈與功率輸出。量測結果得知傳統加熱器溫度分佈呈現非線性且相差達100℃，溫度波動範圍在10℃內，研究中並使用ANSYS與COMSOL熱傳分析工具加以模擬，建立可視化技術。
研究發現熱流板溫度飽時間長短因素取決於加熱器溫度分佈均勻性及加熱功率使用率的高低。傳統加熱器加熱至飽和穩定週期約需370秒，若溫差降低至10℃內則飽和因素週期演算可下降約60%。實際建立溫控配件CAE熱傳模擬與溫控參數設計，顯示溫度分佈相差範圍可進化至15℃內，經實驗證實可控在20℃內，誤差約2.2%。因此得知適當限制加熱器溫控配件對熱流板接觸面積設計，提升溫控配件材質熱傳導係數，增加接觸緊密，熱流道表層受熱的溫度分佈溫差可控性則越好。
未來CAE模擬熱流板熱傳過程及溫度分佈最佳化，縮短飽和時間值得的研究。從加熱器配件非線性熱傳分佈與熱流板結構幾何最佳化熱傳速率及流向研究，讓熱流板溫度飽和能更快均衡分佈。加熱器溫控配件現已專利申請，相關研究成果將有助於提升熱澆道模具開發和成型技術發展與應用。

關鍵字

熱澆道 ； 熱流板 ； 加熱器 ； 熱傳分析

並列摘要

Abstract
In this study, the optimal heater temperature distribution on manifold runner surface, the visualization and controllability of the heater have been learned. The CAE thermal simulation is also applied to establish the heater temperature visualization, seek the optimal temperature distribution and develop the heater adapter module.
At first, the heater quality had been examined by international inspection specification standard MIL-STD-105E. Then we monitored the temperature distribution and the output power of the heater. The monitoring showed the temperature uniformity is nonlinear and the maximum temperature difference is about 100℃. Besides, the heater temperature will has variation in 10℃. After got the heater temperature information, the ANSYS and COMSOL are applied to visualize the heat flux of the heater and design the heater adapter module.
It was found that the temperature uniformity of heater and the heater power are the key issues of saturation time of the manifold temperature. Also the manifold temperature warm up time was too long when using the traditional heater. The traditional heater needs about 370 seconds to reach stable and saturated temperature. The simulation shows that if the temperature distributed range can be reduced from 100℃ to 10℃ and the saturation time will be reduced about 60%.
When apply the heater adapter to control the heat flow and thermal distribution, the simulation result showed that the heater temperature uniformity can be reduced to 15℃ and the experiment result showed that the heater temperature uniformity can be reduced to 20℃. The error between simulation and experiment is 2.2%. The results also showed that the higher heater adaptor conductivity coefficient and control the adapter output area and the tighter heater adaptor can result in good manifold runner temperature uniformity and good control ability of the heater.
The future work will carry on the experiment and the CAE simulation of hot runner manifold heat transfer process to achieve the temperature distribution optimization and reduce the saturation time. Also the non-linear heating of heater adapter and the manifold structure geometric optimization design will be proceeded to control the heat flow and heat transfer.
From this study, it will lead to a better understanding on the heater temperature control of hot runner system. The study results have been applied to patent and provide crescent competitive power in the industry.

並列關鍵字

Manifold ； Heater ； Hot Runner ； CAE Thermal Analysis

參考文獻

11. 王玉琳 , “熱澆道時序閥澆口系統開發與製程特性之研究” ,中原大學機械工程學系研究所碩士論文 (2000).

2. Peter Unger, “Hot Runner Technology”, HANSER Publication (2006).

5. Campo E. Alfredo, “The Complete Part Design Handbook”, HANSER Publication (2008)

參考文獻

1. John P. Beaumount, “Runner and Gating Design Handbook”, HANSER (2007)