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  • 學位論文

降低最長差模連通柱殘斷在厚層印刷電路板中對時域波形與眼圖的影響

Influence and Mitigation of Longest Differential Via Stubs on Transmission Waveform and Eye Diagram in a Thick Multilayered PCB

指導教授 : 薛光華
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摘要


本論文研究在厚層印刷電路板(PCB)中對於時域傳輸波形TDT (Time -Domain Transmission)與眼圖的影響,同時提出對於降低最長的差模連通柱殘段的影響之抑制方案,使用彈跳圖(Lattice Diagram)可以得知時域反射雜訊影響到時域傳輸波形主要是最長的差模訊號連通柱殘段所造成的影響,接著利用彈跳圖(Lattice Diagram) 推導公式用於計算時域傳輸波形波形之步階電壓高度,接下來分析最長的差模連通柱殘段影響時域傳輸波形之參數變化,且對於最長的差模連通柱殘段造成的影響提出了高阻抗差異比與有無嵌入額外空氣連通柱之抑制方案,所提出之抑制方案不管是在時域傳輸波形與眼圖或是頻域差模介入損失|Sdd21|皆大幅抑制了在厚層印刷電路板中最長的差模訊號連通殘段對訊號造成的影響,最後模擬與量測不管在時域或是頻域上皆有很好的一致性,驗證了本論文的分析與所提出的抑制方案是可行的。

並列摘要


This study investigates how the longest differential via stubs in a thick multilayered printed circuit board (PCB) affect the time-domain transmission (TDT) waveform and eye diagram. A reduction scheme is also proposed to mitigate the influence of the longest differential via stubs. The manner in which the time-domain reflection noise that is generated by the longest differential via stubs affects the TDT waveform is then investigated using a lattice diagram. Formulas for step voltages on the TDT waveform are derived by analyzing the lattice diagram. Next, the effects of parameters related to the longest differential via stubs on the TDT waveform are analyzed. A high-impedance difference scheme with/without additional air-via holes is proposed to mitigate the influence of the longest differential via stubs. This mitigation scheme significantly reduces the influence of the longest differential via stubs in a thick multilayered PCB not only in the time domain (TDT waveform and eye diagram) but also in the frequency domain (differential insertion loss |Sdd21|). Finally, favorable comparisons between the simulations and measurements in the time and frequency domains validate the proposed analyses and mitigation scheme.

參考文獻


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